Raytheon Company

Stephen Marinsek

Thomas P Sprafke

Richard J Peralta

Christopher J Cobb

A composite structure includes a first surface and a second surface sandwiched together with a field array of individual and discrete pillars extending therebetween. The plurality of discrete pillars each have a tailored coefficient of thermal expansion and are designed to expand and contract over varying temperatures. The discrete pillars are specifically arranged within the composite structure to compensate for the shrinkage and expansion of different components of a microelectronic hybrid device, to reduce thermal expansion induced deformations imparted on facets of the microelectronic hybrid device under varying temperatures.

Composite structure for image plane normalization of a microelectronic hybrid device

A device includes a substantially planar platform. The device also includes a detector connected to the platform. The device further includes multiple cold fingers including a first cold finger and a second cold finger. Each cold finger has an end portion connected to the platform. Each cold finger is configured to be fluidly coupled to a corresponding cryocooler. Each cold finger is configured to absorb thermal energy generated by the detector. The second cold finger has a flexure region at the end portion.

Cryogenic cold link for multiple coolers

A cooled infrared camera includes a window housing comprising a plate having an opening, a window positioned in the opening of the plate, a first sidewall having a first end connected to the plate, a first flange connected to a second end of the first sidewall such that the first sidewall is between the plate and the first flange, a first explosively welded joint between the plate and the first sidewall, and a second explosively welded joint between the first sidewall and the first flange. A header is connected to the first flange of the window housing, and a warm end is connected to the header. The cooled infrared camera further includes a hermetically sealed chamber within the window housing and the header.

Explosively welded cooled infrared camera

A chip substrate includes a base substrate having a plurality of base circuit traces mounted thereon for supporting a chip assembly and an intermediate substrate mounted on the base substrate adjacent the plurality of base circuit traces. The intermediate substrate has a plurality of intermediate circuit traces mounted thereon. Each of the plurality of intermediate circuit traces are wirebonded to a respective one of the plurality of base circuit traces and the plurality of intermediate circuit traces are configured to be electrically coupled to an external device. For example, each of the plurality of intermediate circuit traces may be wirebonded to a respective one of a plurality of feedthrough circuit traces mounted on a feedthrough device.

Chip substrate for reducing thermal load on a chip assembly mounted thereon

A camera assembly includes a housing inside of which components are maintained at a cryogenic temperature. The components maintained at cryogenic temperature include a detector that is mounted on an integrated circuit, which in turn is mounted on a platform, such as a ceramic platform, which includes electrical connections for the integrated circuit. The camera assembly also includes one or more subplatforms, maintained above the cryogenic temperature, such as ambient temperature, that receive electrical inputs from outside the housing, and make electrical connections to the platform. The connections may be made from the one or more subplatforms, through openings in the platform and/or outside one or more outer edges of the platform. The assembly may include covers of exposed parts of the one or more subplatforms, to facilitate thermal isolation between the interior of the assembly (at cryogenic temperature) and the one or more subplatforms (above cryogenic temperature).

Cryogenic camera assembly with non-cryogenic electrical connection subplatform

Aspects and examples described herein provide a lightweight radiation shielding structure for infrared cameras. In one example, a top radiation shielding element and a bottom radiation shielding element are placed as close as possible to an infrared detector to minimize excess weight added to the infrared camera while providing optimal radiation shielding. Such aspects and examples provide important functionality for numerous weight-sensitive applications in high-radiation environments.

Internal ionizing radiation shielding for infrared cameras

An apparatus includes an optical detector configured to detect at least a portion of incoming radiation. The apparatus also includes an optical component configured to provide at least the portion of the incoming radiation to the optical detector. The apparatus further includes at least one flexure that mounts the optical component to the optical detector. Each flexure is configured to deform in response to expansion or contraction of at least one of the optical component and the optical detector. Each flexure may include a side surface that is flexible in a first dimension and rigid in second and third dimensions, where the dimensions are orthogonal to each other. The optical component may include at least one of a filter, a lens, a polarizer, an aperture, and a cover.

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Albuquerque, NM, United States of America

Stephen Marinsek