Applied Materials, Inc.

Alta Devices, Inc.

Utica Leaseco, LLC

Stephen M Fisher

Brian J Brown

Christopher L Beaudry

Robindranath Banerjee

John M White

Phillip R Sommer

A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.

High throughput polishing system for workpieces

An apparatus for simultaneously polishing wafers including at least a first and a second web of polishing media. At least two polishing heads are provided on a carrier coupled to a drive system such that one polishing head positions a wafer against the first web and a second polishing head positions a second wafer against the second web. The drive system imparts a programmed polishing motion or pattern to the polishing heads.

Planarization system with multiple polishing pads

Growing community of inventors

San Jose, CA, United States of America

Stephen M Fisher