Designer Molecules, Inc.

Henkel Corporation

Quantum Materials Corporation

The Dexter Corporation

Loctite Corporation

Henkel Loctite Corporation

Quantum Materials/dexter Corporation

Schlumberger Technology Corporation

Services Petroliers Schlumberger

Schlumberger Holdings Limited

Prad Research and Development Limited

Stephen M Dershem

Puwei Liu

Kang Yang

Ahmed Hammami

Farhad G Mizori

Dennis B Patterson

Jose A Osuna, Jr

Jose A Osuna

Deborah L Derfelt

Kevin J Forrestal

James T Huneke

Benjamin Neff

Richard R Weaver

Frank D Husson, Jr

Bernadette Craster

Debbie Forray

Deborah Derfelt Forray

Carolyn C Albino

Frank G Mizori

Gina Hoang

Melin Lu

Maria Villegas

Todd Yakimoski

Timothy GJ Jones

Jiarong Wang

Jr Jose A Osuna

The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved by incorporating amide-extended maleimides into an adhesive formulation. Amide-extended maleimides described herein can be used to toughen bismaleimide thermosetting materials without sacrificing any thermal stability. Amide-extended maleimides are readily prepared by reacting a bismaleimide with an appropriate amine via the well-known Michael addition reaction. Acylation of the resulting secondary amines provides the amide-extended maleimide. The acylating agent can also be used to introduce polymerizable functional groups into the backbones of these thermoset monomers. Amide-extended acrylate and methacrylate monomers can also be prepared.

Amide-extended crosslinking compounds and methods for use thereof

Low viscosity, radiation curable compositions have been developed that produce plastics with silicone rubber-like properties. These compositions have also been shown to give great adhesion to plastics. The combination of an ethylenically unsaturated oligomer with di- or polythiol compound, reactive diluents and a radical initiator will produce these properties. These materials can find use in many areas such as: Electronics packaging, displays, conformal coatings, seals, gaskets, fiber optics coatings, and golf ball coatings.

Curable composition with rubber-like properties

The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.

Materials and methods for stress reduction in semiconductor wafer passivation layers

The present invention provides amorphous maleimide-bismaleimide hybrid mixtures and methods for synthesizing such mixtures by condensation of diamine compounds with maleic anhydride along with one or more additional anhydrides. The invention provides a route to get passed the high melting point and the solubility issues of bismaleimide resins, yet to still obtain the good thermo-mechanical properties of these valuable molecules.

Maleimide-functional monomers in amorphous form

The invention is based on the discovery that addition of certain carboxylic acid derivatives of siloxanes to thermosetting adhesive compositions and die-attach pastes renders such compositions and pastes extremely resistant to resin bleed. The present invention provides siloxane-carboxylic acid compounds useful as anti-bleed additives. Also provided are adhesive compositions and pastes containing the compounds of the invention, which are particularly useful in applications that require little to no resin bleed prior to curing of the compositions (such as e.g., electronic packaging applications).

Anti-bleed compounds, compositions and methods for use thereof

The invention is based on the discovery that modified calcium carbonates can be used as fillers for the preparation of non-abrasive adhesive formulations that are useful in microelectronic applications. The modified calcium carbonate fillers possess functional groups, which form strong bonds to the thermoset matrix. Invention compositions display excellent rheological properties, in addition to a low coefficient of thermal expansion.

Modified calcium carbonate-filled adhesive compositions and methods for use thereof

The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.

Imide-linked maleimide and polymaleimide compounds

The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Curatives for epoxy compositions

The present invention provides conductivity promoters, and in particular soluble conductivity promoters that contain a hydrocarbon moiety or a siloxane moiety and a metal. The present invention also provides methods of making soluble conductivity promoters and adhesive compositions containing the conductivity promoters of the invention.

Soluble metal salts for use as conductivity promoters

The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.

Thermosetting adhesive compositions

The present invention provides hydrolytically resistant monomers prepared by the reaction of an epoxy compound and a reactive ester and methods for producing the monomers. Also provided are adhesive compositions containing the hydrolytically resistant monomers and methods for use thereof.

Hydrolytically resistant thermoset monomers

The invention generally relates to di-cinnamyl compounds useful in a variety of adhesive applications. More specifically, the invention provides chain-extended bismaleimides and methods for generating them by reaction with di-cinnamyl compounds, including particular di-cinnamyl compounds disclosed herein. Invention di-cinnamyl compounds can also be used as co-monomers in a Diels-Alder type cure, and can act as a co-monomer in a thermoset composition with a maleimide monomer.

Di-cinnamyl compounds and methods for use thereof

A variety of curing agents for epoxy resins and methods for preparation thereof are disclosed, including compounds having the structures of formulas III and IV: wherein each of R, R, R, R, and Ris independently selected from the group consisting of H, methyl, ethyl, n-propyl, iso-propyl, a butyl, and phenyl. Epoxy-based compositions including various curing agents are also disclosed. Other epoxy curatives containing amino, phenol, and/or imine groups are disclosed.

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San Diego, CA, United States of America

Stephen M Dershem