Invensense, Inc.

Stephen Lloyd

Martin Lim

Michael Julian Daneman

Joseph Seeger

Matthew Julian Thompson

Julius Ming-Lin Tsai

Renata Melamud Berger

Xiang Li

Erhan Polatkan Ata

Derek Keith Shaeffer

Erik E Anderson

Jongwoo Shin

David Sachs

Jong Il Shin

Ilya Gurin

David William Devries

Nathan Royer

Li-Wen Hung

Mehran Ayat

Doug Vargha

Kerry Keal

An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.

Ultrasonic sensing device

A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device. In one example, the first MEMS device further comprises a normally open switch that closes when the external influence exceeds the threshold value.

Device and method for a threshold sensor

A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device.

A system and/or method for efficiently operating a MEMS gyroscope without drive circuitry and/or with drive circuitry and a non-constant oscillating amplitude. In a non-limiting example, drive circuitry may be utilized to drive the MEMS gyroscope proof mass to a desired oscillating amplitude, and then the drive circuitry may be powered off. Rotational velocity may be sensed while the proof mass is being driven to a desired oscillating amplitude, while the proof mass is being maintained at a desired oscillating amplitude, and/or while the proof mass amplitude decays.

High-Q MEMS gyroscope

A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first MEMS substrate is attached to the first surface of the CMOS substrate. The package further includes a second MEMS substrate with a first surface and a second surface, where the first surface of the second MEMS substrate is attached to the second surface of the CMOS substrate and the second surface of the second MEMS substrate is attached to a packaging substrate. The first MEMS substrate, the CMOS substrate, the second MEMS substrate and the packaging substrate are provided with electrical inter-connects.

MEMS-CMOS-MEMS platform

A system and method for providing and/or controlling air flow to an air sensor. As a non-limiting example, an air sensor system may include mechanical and/or electromechanical features (e.g., MEMS features) to control air flow to an air sensor. Various aspects of the disclosure may, for example, be implemented in a personal electronic device.

Air sensor with air flow control

Systems and methods are disclosed for implementing optical image stabilization (OIS) in a mobile device. One or more functions associated with OIS may be performed by hardware and/or processing resources that are provided independently of a camera unit.

Systems and methods for optical image stabilization using a digital interface

A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.

MEMS acoustic sensor with integrated back cavity

A method and system for a device with a magnetic sensor element and magnetic storage elements is disclosed. The device includes an integrated circuit substrate. At least a magnetic sensor with a magnetic sensor element with a permanent magnet is disposed over the integrated circuit substrate. A plurality of magnetic storage elements, each with at least one permanent magnet is disposed over the integrated circuit substrate.

Application specific integrated circuit with integrated magnetic sensor

A Micro-Electro-Mechanical Systems (MEMS) device includes a first substrate with a first surface and a second surface, the first substrate including a base layer, a moveable beam disposed on the base layer, at least one metal layer, and one or more standoffs disposed on the base layer such that one or more metal layers are situated on the top surface of the one or more standoffs. The MEMS device further includes a second substrate including one or more metal layers bonded to the one or more standoffs resulting in an electrical connection between at least a portion of the one or more metal layers of the second substrate and one or more of the at least one electrode on the bottom surface and the at least one electrode on the top surface.

Integrated structure with bidirectional vertical actuation

The present invention relates to a combination of a 6-axis motion sensor having a 3-axis gyroscope and a 3-axis linear accelerometer, a motion processor and a radio integrated circuit chip (IC), wherein the intelligence in the motion processor enables the communication between the motion sensor, the radio IC and the external network. The motion processor also enables power savings by adaptively controlling the data rate of the motion sensor, depending on the amount or speed of the motion activity.

Growing community of inventors

Los Altos, CA, United States of America

Stephen Lloyd