International Business Machines Corporation

Stephen L Tisdale

Alfred Viehbeck

Elizabeth F Foster

Voya Rista Markovich

Jeffrey Curtis Hedrick

Martin J Goldberg

Linda C Matthew

Harry R Bickford

Jane M Shaw

Stephen L Buchwalter

Carlos Juan Sambucetti

Terrence Robert O'Toole

Donald G McBride

Ali Afzali-ardakani

Rodney T Hodgson

Shahrokh Daijavad

Steven E Molis

Caroline A Kovac

Ashit A Mehta

Bodil E Braren

James L Hedrick, Jr

Peter J Duke

Juan Ayala-Esquilin

Roy H Magnuson

Konstantinos I Papathomas

Robert Maynard Japp

Kostas I Papathomas

Anilkumar Chinuprasad Bhatt

Thomas R Miller

Kurt R Grebe

Donna Jean Trevitt

Walter P Pawlowski

John J Glenning

Paul William Coteus

Jeffrey Donald Gelorme

Stephen Joseph Fuerniss

Ronald A Kaschak

James Russell Bupp

Dae Young Jung

Michael R Scheuermann

Robert G Rickert

Douglas Adam Cywar

Amarjit S Rai

Kathleen L Covert

Richard William Malek

David E King

Mark J Schadt

Arthur E Graham

Gary K Lemon

Dennis A Canfield

Thomas H Lewis

William A Donson

Peter A Burnett

Charles C Emmons

Charyl L Tytran

Aldred Viehbeck

Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A permanent photoimagable dielectric layer is formed over the wiring layer and via holes are formed through the dielectric layer over pads and conductors of the wiring layer. Holes are formed through the substrate and substrate surfaces including the photoimagable dielectric, walls of the via holes, and walls of the through holes subjected to an electroless copper plating process. The process includes seeding the surface, coating the surface with a first solution containing surfactant and electroplating in a second solution in which the level of surfactant is regulated by determining the surface tension and metering surfactant addition to the second solution depending on the determination of surface tension. The copper plating on the photoimagable dielectric is patterned to form an exterior wiring layer which is covered by solder resist with windows over lands around the through holes and surface mount connection pads of the exterior wiring layer to form a high density circuitized substrate. Surface mount components and/or pin in hole components are attached to the circuitized substrate with solder joints between terminals of the components and the lands and/or connection pads to form a high density circuit board assembly. One or more of the circuit board assemblies are mounted in an enclosure with a power supply, CPU, RAM, and I/O means to form an information handling system with increased performance due to shorter signal flight times due to the higher device density.

Manufacturing computer systems with fine line circuitized substrates

Disclosed is a printed circuit board, and a method of preparing a printed circuit board, which possesses a coefficient of thermal expansion substantially similar to that of silicon for use in direct semiconductor chip attach structures and similar solder mounted devices. The printed circuit board is fabricated from prepreg having a thermosetting resin and a reinforcement layer consisting of non-woven aramid mat or a liquid crystalline polymer paper. The composite dielectric layer optionally includes plated through holes which are either filled or non-filled, and one or more thin film redistribution layers to provide high density electronic packages. The design places the solder pads at the PTHs where needed. The redistribution layer can be formed using photoimagable dielectrics or laminated controlled-CTE composites and laser via imaging.

High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer

The method for forming circuitization of the present invention provides a circuitized product which does not have a blanket seed layer and only has seed layer under the metal circuitization. Thus, short circuits between circuit lines are eliminated. It is a further advantage of the method of the present invention that it does not involve stripping portions of the seed layer. The method of the present invention requires less processing steps than conventional methods and employs positive resists which are developable by aqueous alkaline solutions. Specifically, the method of the present invention for forming circuitization in a circuit board comprising the following steps: providing a dielectric substrate; applying a positive photoresist to the dielectric substrate; then exposing the positive resist through art work corresponding to the desired circuit pattern; then developing the resist with an aqueous alkaline solution to form the circuit pattern in the resist; then applying a seeding composition to the patterned substrate of step d; exposing the remaining resist to actinic radiation; developing the remaining acidified resist with an aqueous alkaline solution to remove photoresist not coated with seed to form a seed pattern; and then electrolessly plating metal onto the seed pattern so as to form the metallized circuit pattern.

Method for pattern seeding and plating of high density printed circuit boards

Disclosed is an admixture which is curable to form a crack resistant, photosensitive polycyanurate resist. Also disclosed is a structure for its use and process of making. The resist can be tailored to be either positively or negatively sensitive to actinic radiation. Because of its improved thermal and mechanical properties, the cured resist is suitable for use at high temperature, such as in electronic packaging applications.

Toughened photosensitive polycyanurate resist, and structure made

A structure including a halogenated polymeric-containing layer. At least a portion of a surface of the halogenated polymeric-containing layer is electrochemically reduced. An electrically conductive pattern is provided over at least a portion of the electrochemically reduced portion of the halogenated polymeric-containing layer.

Structure including a partially electrochemically reduced halogenated

The invention involves a fluid treatment device and fluid treatment method to solution or melt coat or impregnate a resin or polymer to a predetermined, metered thickness into a substrate. The invention is effective in impregnating or coating various substrates in both a continuous or batch process on one side, two sides, or in the case of a porous substrate, penetration and complete saturation is possible. The invention offers significant advantages and benefits over existing methods and equipment and allows the coating or impregnation process to be performed at lower cost and higher efficiency with increased environmental safety.

Fluid jet impregnating and coating device with thickness control

This invention describes a new process for the selective isolation of through holes in the production of a multi-layer printed circuit card which allows for substantially smaller holes through reference layers to be built, leading to substantially better electrical isolation of signal traces on adjacent wiring layers, and for substantially improved current carrying capacity in the reference layers. This invention also describes a process to allow reference layers of different thickness from adjacent signal layers, even if they are part of the same `core`. Several different process flows are disclosed, leading to substantially the same structure but with varying degrees of complexity and quality of the finished product.

Method for providing a selective reference layer isolation technique for

The invention involves a fluid treatment device to solution or melt impregnate a resin or polymer or any combination thereof into a reinforcement which can be utilized to fabricate composite materials for laminates, circuit boards, structural/aerospace materials, automotive components, etc. The invention offers significant advantages and benefits over existing methods and equipment and allows the impregnation process to be performed at lower cost and higher efficiency with increased environmental safety.

Fluid jet impregnation

A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

Method for conditioning halogenated polymeric materials and structures

An apparatus for applying a fluid to an outer surface of an elongated work piece having a longitudinal axis and a cross sectional shape, perpendicular to the longitudinal axis. The apparatus has a head member having an interior wall cross sectional shape adapted for receiving the cross sectional shape of the elongated work piece. The interior cross sectional shape defines an interior wall of the head member. The head member has an input end and an output end. The interior wall has means for applying the fluid to a surface of said elongated member. The head member has preferable a first part and a second part which are joined by an expandable member. The means for applying said fluid comprises a plurality of jets for directing said fluid on said surface and a plurality of output parts for recovering said fluid for applying a fluid to an outer surface, said elongated work piece having a longitudinal axis and a cross sectional shape, perpendicular to said longitudinal axis, comprising:

Expandable fluid treatment device for tublar surface treatments

A method of treating a halogenated polymeric-containing substrate including exposing at least portions of the halogenated polymeric-containing substrate to a composition containing a reducing agent and an aprotic solvent selected from the group consisting of nitriles, nitro compounds, amides, esters, carbonates, oxides, sulfo compounds and mixtures thereof. The solvent is free of ethers, amines, ammonia. The composition is prepared by reacting a metal with an organic compound selected from the group consisting of polyaryl compounds, aromatic carbonyl containing compounds, aromatic nitriles, and aromatic heterocyclic nitrogen containing compounds in a reaction solvent that does not react with the metal but permits reaction between the metal and the organic compound to thereby provide the reducing agent. The reducing agent is isolated from the reaction solvent to obtain a reaction product as a solid. The reaction product is added to the aprotic solvent. The treated substrate is contacted with a material to promote adhesion of the material to the treated surface.

Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.

Fluorinated carbon polymer composites

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Vestal, NY, United States of America

Stephen L Tisdale