Seh America, Inc.

Stephen L Martin

Yoshinori Suzuki

Oleg V Kononchuk

Shigeru Oba

Methods and computer program products are provided for analyzing a crystalline structure, such as a wafer or an epitaxial layer in more detail, including the portion of the crystalline structure proximate the edge. The methods and computer program products of one aspect determine the average thickness and the normalized profile of a crystalline structure with enhanced detail. Additionally, the method and computer program product of another aspect represent the profile proximate the edge of the crystalline structure with a pair of lines that are selected to permit the profile of the crystalline structure proximate the edge of the crystalline structure to be characterized in more detail. Further, the method of yet another aspect permits the average edge profile for a plurality of crystalline structure to be defined.

Methods and computer program products for characterizing a crystalline structure

A system and method for sorting semiconductor substrates based on substrate thickness. The invention includes weighing each semiconductor substrate to be sorted, and then calculating the thickness of each substrate from its mass, area and density. The system may be configured to automatically sort the substrates according to the weight-based thickness calculations.

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Vancouver, WA, United States of America

Stephen L Martin