Bae Systems Controls Inc.

Stephen L Homan

Cameron R Vakili

Robert J Vovos

Stephen John Kosteva

Leslie R Baker

Arthur Paull Lyons

A laminated DC busbar, a DC backplane and a DC busbar system with super low inductance is provided. Semiconductor switches may be connected to respective laminated DC busbars. The DC busbar system comprises a DC backplane and at least two laminated DC busbars respectively connected to semiconductor switches. The round-trip inductance between semiconductor switches connected to two adjacent laminated DC busbars via the DC backplane is less than about 7.5 nH.

DC busbar system, laminated DC busbar and DC backplane with super low inductance

An AC busbar for connecting at least three phases from a semiconductor switching unit to a load is provided. The AC busbar parallelly connects the at least three phases and provides current balancing. The AC busbar has a terminal-side conductor mechanically connectable to each AC terminal of the semiconductor switching unit and a load-side conductor positioned between the terminal-side conductor and the load. A distance between the terminal-side conductor and the load-side conductor is such that a difference in an inductance between a connection point for a respective AC terminal of each phase and a common point on a middle of the load-side conductor is less than a predetermined percentage with respect to an average of the respective inductances.

AC busbar for current sharing between parallelly connected semiconductor switching pairs

A cooling system for a modular power control system (MPCS) is provided. The MPCS comprises modules. Each module has a chassis with a first manifold segment for first common manifold and a second manifold segment for second common manifold. When the modules are mounts to each other, the first manifold segments align to form the first common manifold and the second manifold segments align to form the second common manifold, providing two fluid channels between endcaps. The chassis of at least two modules further have a first opening providing a fluid interface region between the first common manifold and a module specific flow path, and a second opening providing a fluid interface region between the module specific flow path and the second common manifold. The module specific flow path provides at least one fluid branch between the first common manifold and the second common manifold.

Cooling system with common modular manifolds

A cooling system and method for cooling a contactor from the contactor-terminal side or both the contactor-mount side is provided. The contactors may be mounted to a base of a chassis. The cover may have one or more fluid channels associated with an exterior side of the cover. The interior side may have a plurality of thermally conductive bosses projecting from the interior surface configured to indirectly contact busbars which are respectively connected to contactor terminals of the contactors via thermal pads to provide a heat transfer path between the busbars and the fluid within the one or more fluid channels associated with the exterior side of the cover. Certain of the thermally conductive bosses are offset from the one or more fluid channels.

Growing community of inventors

Endicott, NY, United States of America

Stephen L Homan