Growing community of inventors

Ottawa, Canada

Stephen Joseph Kovacic

Average Co-Inventor Count = 2.40

ph-index = 7

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 105

Stephen Joseph KovacicFoad Arfaei Malekzadeh (10 patents)Stephen Joseph KovacicDinhphuoc Vu Hoang (6 patents)Stephen Joseph KovacicAbdulhadi Ebrahim Abdulhadi (5 patents)Stephen Joseph KovacicWilliam John Domino (3 patents)Stephen Joseph KovacicMichael Joseph McPartlin (3 patents)Stephen Joseph KovacicDominique Michel Yves Brunel (3 patents)Stephen Joseph KovacicBharatjeet Singh Gill (3 patents)Stephen Joseph KovacicSanjeev Kumar Jain (2 patents)Stephen Joseph KovacicRené Rodríguez (2 patents)Stephen Joseph KovacicImran Sherazi (2 patents)Stephen Joseph KovacicIman Sherazi (2 patents)Stephen Joseph KovacicRobert Francis Darveaux (1 patent)Stephen Joseph KovacicAnthony James Lobianco (1 patent)Stephen Joseph KovacicHoang Mong Nguyen (1 patent)Stephen Joseph KovacicCormac Michael O'Connell (1 patent)Stephen Joseph KovacicHardik Bhupendra Modi (1 patent)Stephen Joseph KovacicKi Wook Lee (1 patent)Stephen Joseph KovacicLori Ann DeOrio (1 patent)Stephen Joseph KovacicPhilip Macphail (1 patent)Stephen Joseph KovacicJeremy Loraine (1 patent)Stephen Joseph KovacicDerek C Houghton (1 patent)Stephen Joseph KovacicJeffery Wojtiuk (1 patent)Stephen Joseph KovacicRené Rodriguez (1 patent)Stephen Joseph KovacicStephen Joseph Kovacic (27 patents)Foad Arfaei MalekzadehFoad Arfaei Malekzadeh (14 patents)Dinhphuoc Vu HoangDinhphuoc Vu Hoang (46 patents)Abdulhadi Ebrahim AbdulhadiAbdulhadi Ebrahim Abdulhadi (10 patents)William John DominoWilliam John Domino (100 patents)Michael Joseph McPartlinMichael Joseph McPartlin (28 patents)Dominique Michel Yves BrunelDominique Michel Yves Brunel (24 patents)Bharatjeet Singh GillBharatjeet Singh Gill (12 patents)Sanjeev Kumar JainSanjeev Kumar Jain (48 patents)René RodríguezRené Rodríguez (20 patents)Imran SheraziImran Sherazi (2 patents)Iman SheraziIman Sherazi (2 patents)Robert Francis DarveauxRobert Francis Darveaux (75 patents)Anthony James LobiancoAnthony James Lobianco (68 patents)Hoang Mong NguyenHoang Mong Nguyen (56 patents)Cormac Michael O'ConnellCormac Michael O'Connell (52 patents)Hardik Bhupendra ModiHardik Bhupendra Modi (35 patents)Ki Wook LeeKi Wook Lee (26 patents)Lori Ann DeOrioLori Ann DeOrio (17 patents)Philip MacphailPhilip Macphail (4 patents)Jeremy LoraineJeremy Loraine (3 patents)Derek C HoughtonDerek C Houghton (3 patents)Jeffery WojtiukJeffery Wojtiuk (2 patents)René RodriguezRené Rodriguez (2 patents)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Skyworks Solutions, Inc. (18 from 2,615 patents)

2. Gennum Corporation (4 from 83 patents)

3. Sige Semiconductor, Inc. (4 from 68 patents)

4. Other (1 from 832,680 patents)


27 patents:

1. 11735815 - Reconfigurable antenna systems integrated with metal case

2. 11664597 - Planar end fire antenna for wideband low form factor applications

3. 11563469 - Beamforming communication systems with power amplifier output impedance tuning control

4. 11515845 - Direct substrate to solder bump connection for thermal management in flip chip amplifiers

5. 11374610 - Radio front end module with reduced loss and increased linearity

6. 11323158 - Beamforming communication systems with power amplifier output impedance tuning control

7. 11283170 - Apparatus and methods for dynamic management of antenna arrays

8. 11245190 - Planar end fire antenna for wideband low form factor applications

9. 11158938 - Reconfigurable antenna systems integrated with metal case

10. 11069978 - Method of manufacturing a radio-frequency module with a conformal shield antenna

11. 11018714 - Radio front end module with reduced loss and increased linearity

12. 10924164 - Beamforming communication systems with power control based on antenna pattern configuration

13. 10847888 - Planar end fire antenna for wideband low form factor applications

14. 10790788 - Direct substrate to solder bump connection for thermal management in flip chip amplifiers

15. 10658977 - Power amplifiers isolated by differential ground

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as of
12/4/2025
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