Hewlett-packard Development Company, L.p.

Other

Hewlett-packard Company

Stephen Jalrus Potochnik

Eric Lee Nikkel

Michael G Monroe

Chien-Hua Chen

Kenneth James Faase

Mickey Szepesi

Michele K Szepesi

Richard P Tomasco

Charles Craig Haluzak

Sadiq Bengali

A method of indicating the progress of a sacrificial material removal process, the method, comprising; freeing a portion of a member, the member being disposed in a cage and laterally surrounded by the sacrificial material; and preventing the freed portion of the member from floating away by retaining the freed member.

Metrology structure and methods

A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, defining an actuating area for the MEMS device on the dielectric layer, including depositing a conductive material on the dielectric layer and communicating the conductive material with the at least one conductive layer of the substructure through the dielectric layer, forming a sacrificial layer over the conductive material and the dielectric layer, including depositing silicon over the conductive material and the dielectric layer, and forming a substantially planar surface of the silicon, forming an actuating element over the sacrificial layer within the actuating area, including communicating the actuating element with the conductive material of the actuating area through the sacrificial layer, and substantially removing the sacrificial layer between the actuating element and the dielectric layer.

MEMS device and method of forming MEMS device

A microelectromechanical system (MEMS) device is created by forming mechanical structures supported by a substrate having a bond ring area laterally spaced from the mechanical structures and having a sacrificial layer surrounding the mechanical structures. A bond ring material is formed on top of the sacrificial layer and the bond ring area. Some of the bond ring material is then removed to create a bond ring.

Micro-electromechanical system

A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a first side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, forming a protective layer over the dielectric layer, defining an electrical contact area for the MEMS device on the protective layer, and forming an opening within the electrical contact area through the protective layer and the dielectric layer to the at least one conductive layer of the substructure.

A method of forming a fluid drop emitting apparatus such as an ink jet printing device that includes forming a portion of a fluid drop generator structure on a first surface of a substrate, forming narrow slots in a second surface of the substrate, and etching the narrow slots to form anchor grooves.

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Corvallis, OR, United States of America

Stephen Jalrus Potochnik