Littelfuse, Inc.

Littlefuse, Inc.

Dongguan Littelfuse Electronics Company Limited

Stephen J Whitney

G Todd Dietsch

Gordon Todd Dietsch

Louis Rector

Hugh M Hyatt

Anthony D Minervini

Edwin James Harris

Wen Ju Yang

Honorio S Luciano

Hailang Tang

Olga Spaldon-Stewart

Huawei Yin

Jeffrey Paul Youngblood

Maxwill P Bassler

Conrado De Leon

Scott Allen Davidson

John Song

Daniel B Onken

William G Rodseth

Robert G Swensen

Timothy E Pachla

Bienvenido Salonga

Michael J Weber

Tushar Vyas

Carl S Reid

Demetrios Thanopoulos

Janus Pagharion

William P Brown

David Perry

Jeffrey Niew

James Chen

John Emannuel Semana

Francisco De Guia

William Travis

David Zhang

Sarah M Book

Edward D Barriball

Milea J Kittle

John E C Semana

Christian Garcia

Phil Shaw

Jamica P Bato

Jeffery A Whalin

Ramon Leon

Kelvin Loader

Edgardo Olan

Vincent Minh-Tu Tran

A circuit protection device including a housing defining a chamber and a metal oxide varistor (MOV) stack disposed within the chamber. A first spring is electrically attached at a first end to a first input terminal of the MOV stack by a solder connection and at a second end to a first input line. The first spring is biased away from the first input terminal. A second spring is electrically attached to a second input terminal of the MOV stack by a solder connection and at a second end to a second input line. The second conductive spring is biased away from the second input terminal. When an overvoltage condition occurs, heat generated by the MOV stack melts at least one of the first or second solder connections to allow the corresponding springs to be displaced away from the respective MOV stack input terminals.

Surge protection device

A circuit protection device including a housing () defining a chamber () and a metal oxide varistor (MOV) stack () disposed within the chamber (). A first spring () is electrically attached at a first end to a first input terminal () of the MOV stack () by a solder connection () and at a second end to a first input line (). The first spring () is biased away from the first input terminal (). A second spring () is electrically attached to a second input terminal () of the MOV stack () by a solder connection () and at a second end to a second input line (). The second conductive spring () is biased away from the second input terminal (). When an overvoltage condition occurs, heat generated by the MOV stack () melts at least one of the first or second solder connections () to allow the corresponding springs to be displaced away from the respective MOV stack () input terminals (), thereby creating an opening circuit.

A fuse in one embodiment includes first and second leads. A fuse element provides electrical communication between the first and second leads. The fuse element includes a material with a melting point of less than 250.degree. C. and acts as both an overcurrent fuse and a thermal fuse by melting when subjected to a predetermined current or upon reaching a predetermined temperature. A body houses the fuse element and portions of the first and second leads.

Fuse providing overcurrent and thermal protection

A circuit protection device includes a conductive layer which is connected to first and second terminals. A spring is electrically connected to the first and second terminals. When an over-voltage or over-temperature condition occurs within a charging circuit, one or more heat generating resistive elements melts material associated with one or more of the ends of the spring thereby releasing the spring to create an open circuit.

Circuit protection device

A surface mount fuse in one embodiment includes an insulative body, first and second conductive and caps attached to the insulative body, each end cap defining an aperture, and a fuse element extending (i) through the insulative body and the apertures and (ii) along outside surfaces of the first and second conductive end caps in such a way that solder used to attach the first and second conductive end caps to an external medium also fastens the fuse element to the first and second end caps.

Solderless surface mount fuse

A fuse element includes a substrate disposed between first and second terminals. The substrate includes an electrically insulative material. A conductive film is disposed on a first surface of the substrate and in electrical contact with the first terminal and second terminals.

Fusible substrate

A fused conductor includes a first conductor portion, a second conductor portion, and a fuse element in electrical communication with the first and second conductor portions via at least one dual metal wire, the fuse element protected by a glass body bonded chemically to the dual metal wire.

Electrical device with integrally fused conductor

An integral circuit protection device includes a substrate disposed between first and second terminals. The substrate is composed of a resistive material. A first conductive layer is disposed on a first surface of the substrate and in electrical contact with the first terminal. A second conductive layer is disposed on a second surface of the substrate. A first electrically insulating layer is disposed on the second conductive layer and substantially covers the second conductive layer. The first electrically insulating layer includes an aperture. A fuse element is disposed on the first electrically insulating layer and is in electrical contact with the second conductive layer through the aperture and in electrical contact with the second terminal. The fuse element is in electrical series with the resistive material. A second electrically insulating layer is disposed over the fuse element.

Circuit protection device including resistor and fuse element

Electrostatic discharge protection, also known as ESD protection, is provided in the form of a discrete array with a voltage variable material (VVM) or a VVM device. The array is fabricated with a common electrode for connection to ground, and one or more electrodes configured for connection to an electrical component. The electrical component is a connector attached to an electrical circuit containing devices subject to damage by ESD events. The array is placed into a pocket or space on the connector and is held in place mechanically by spring force or by soldering to leads or electrodes of the connector. The array may be soldered to a ground connection or held in place by pressure, such as from a spring or from an outer housing or shell. In some embodiments, the array is removable from the component without affecting component circuits other than removal of ESD protection.

Incorporating electrostatic protection into miniature connectors

A gas-filled surge arrester includes at least two electrodes, a gas filling and an activating compound applied to at least one of said electrodes. The activating compound can include: (i) nickel powder in an amount of about 10% to about 35% by weight; (ii) potassium or sodium silicate in an amount of about 20% to about 40% by weight; (iii) titanium powder in an amount of about 5% to about 25% by weight; (iv) calcium titanium oxide in an amount of about 5% to about 15% by weight; and (v) sodium bromide in an amount of about 10% to about 20% by weight. Ignition striping process and resulting stripes from ink-jetting of striping material are disclosed.

Gas-filled surge arrester, activating compound, ignition stripes and method therefore

Electrical fuse indicators which may be used to diagnose and identify a fault state or failure mode of the electrical fuse include in various exemplary embodiments, indicator materials such as a reactive material, which are incorporated into various fuse indicator devices to cooperate with a visually perceptible indicator portion or layer to indicate the failure mode or fault state if the electrical fuse.

Diagnostic fuse indicator including visual status identifier

In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insultive fuse body is provided to further decouple the fuse element from its surroundings.

Thermally decoupling fuse holder and assembly

An electrical circuit protection device has an overcurrent protection portion and an overvoltage protection portion. The overcurrent protection portion has a surface. The overvoltage protection portion is disposed on the surface and thermally coupled to the overcurrent protection portion. A number of terminations connect the overcurrent protection portion and the overvoltage protection portion to a printed circuit board or other electrical circuit.

Integrated overvoltage and overcurrent device

A voltage variable material ('VVM') including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.

Direct application voltage variable material, components thereof and devices employing same

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Lake Zurich, IL, United States of America

Stephen J Whitney