Honeywell International Inc.

Stephen J Pamperin

John F Anderson

Martin Schaeffer

A backlight assembly is provided for deployment within a flat panel display assembly, as are methods for manufacturing such a backlight assembly. In one embodiment, the method includes the steps of fabricating a printed wiring board (PWB) having a display-facing surface, disposing a casing sidewall around the PWB to create light cavity within the backlight assembly, and electrically coupling a plurality of light emitting diodes (LEDs) to the PWB. A reflective solder mask is deposited over the display-facing surface of the PWB, and a first reflective silkscreen layer is applied over the reflective solder mask utilizing a silkscreen process. The first reflective silkscreen layer cooperates with the reflective solder mask to increase the reflectivity of the light cavity over the visible color spectrum.

Methods for the manufacture of high efficiency backlight assemblies for flat panel display assemblies

A backlight assembly is provided for deployment within a flat panel display assembly. In one embodiment, the backlight assembly includes a printed wiring board (PWB), a casing sidewall, a plurality of light emitting diodes (LEDs), a reflective solder mask, and a first reflective silkscreen layer. The PWB includes a display-facing surface, and the casing sidewall disposed is around a peripheral portion of the PWB and cooperates with the display-facing surface to define a light cavity. The plurality of LEDs us electrically coupled to the PWB and illuminates the light cavity when energized. The reflective solder mask overlays the display-facing surface of the PWB, and the first reflective silkscreen layer overlays the reflective solder mask. The first reflective silkscreen layer cooperates with the reflective solder mask to increase the reflectivity of the light cavity over the visible color spectrum.

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Scottsdale, AZ, United States of America

Stephen J Pamperin