Battelle Memorial Institute

Stephen J Krak

Eric L Hogue

Timothy J Stanfield

Joel D Elhard

Richard P Heggs

A system for forming a pattern on a part comprises a chamber base, a pressure vessel and a retaining device. The retaining device is positionable between the chamber base and the pressure vessel to secure a deformable mask therebetween. The system further comprises a first pressure source, a second pressure source and a third pressure source. The first pressure source provides a negative pressure within the chamber to draw the mask towards a part installed within the chamber base. The second pressure source provides a positive pressure within the pressure vessel to direct the mask towards the part so that the mask corresponds to at least one complex non-planar surface of the part. The third pressure source provides a negative pressure within pressure vessel. An exposure source exposes the part through the mask while the mask is deformed corresponding to the at least one complex non-planar surface of the part.

Patterning non-planar surfaces

A pattern is formed on a non-planar surface by forming a layer of photoresist on a part having a surface comprising a non-planar surface area. A deformable mask is aligned over at least a portion of the non-planar surface area of the part such that the deformable mask substantially deforms in a manner corresponding to at least a portion of the non-planar surface area of the part. The photoresist on the part is exposed through the mask so as to transfer a desired pattern onto the part while the deformable mask is maintained in a deformed state.

Electromagnetic radiation sensitive mask materials are provided. The mask materials are chosen such a first percentage of electromagnetic radiation at a first wavelength is transmitted through the mask material prior to the exposure of the mask material to electromagnetic radiation at a second wavelength and a second percentage of electromagnetic radiation at the first wavelength is transmitted through at least a portion of the mask material after the at least a portion of the mask material is exposed to electromagnetic radiation at the second wavelength. Methods of patterning substrates using electromagnetic radiation sensitive mask materials are also provided. Compositions for producing masks are provided, and systems are provided.

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Newark, OH, United States of America

Stephen J Krak