Intel Corporation

Stephen H Hall

Khang Choong Yong

Bryce D Horine

Howard L Heck

Gary A Brist

Yun Rou Lim

Bok Eng Cheah

Jackson Chung Peng Kong

Tao Liang

Wil Choon Song

Chin Lee Kuan

Chaitanya Sreerama

Ramaswamy Parthasarathy

Raymond Chong

Ying Ern Ho

Michael W Leddige

Ricardo Suarez-Gartner

Anusha Moonshiram

Kemal Aygun

Kooi Chi Ooi

Harry G Skinner

Michael E Deisher

Maynard C Falconer

Dong-Ho Han

Keith Raynard Tinsley

Jun Liao

Jason A Mix

Emile Davies-Venn

Konika Ganguly

Olufemi B Oluwafemi

Cory Mason

Kirankumar Kamisetty

Stephen Christianson

Eric C Gantner

M Reza Zamani

Earl Wight

Paul Huray

Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The package substrate includes a plurality of conductive bumps on a surface of the conductive line, where the conductive bumps are conductively coupled to the conductive line, and a solder resist over the conductive line and the dielectric. The surface of the conductive line may be a bottom surface, where the conductive bumps are below the conductive line and conductively coupled to the bottom surface of the conductive line, and where the conductive bumps may be embedded in the dielectric. The surface of the conductive line may be a top surface, where the conductive bumps are above the conductive line and conductively coupled to the top surface of the conductive line, and wherein the conductive bumps are embedded in the solder resist.

Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission

Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

Pattern-edged metal-plane resonance-suppression

Techniques for fabricating a package substrate and/or a stiffener for a semiconductor package are described. For one technique, a package substrate comprises: a routing layer comprising a dielectric layer. A stiffener may be above the routing layer and a conductive line may be on the routing layer, the conductive line comprising first and second portions, the first portion having a first width, the second portion having a second width, the conductive line extending from a first region of the routing layer to a second region of the routing layer, the first region being under the stiffener, the second region being outside the stiffener, the first portion being on the first region, and the second portion being on the second region. One or more portions of the conductive line can be perpendicular to an edge of the stiffener. The perpendicular portion(s) may comprise a transition between the first and second widths.

Stiffener and package substrate for a semiconductor package

An apparatus is provided which comprises: a crystal having an input and an output; a first interconnect line having first and second ends, wherein the first end is coupled to the input; a second interconnect line having first and second ends, wherein the first end is coupled to the output; a first capacitor coupled to the input and ground; and a second capacitor coupled to the second end of the second interconnect line. An apparatus is provided which comprises: a high pass filter; a pair of AC coupling capacitors coupled to the high pass filter; a low pass filter coupled to the pair of AC coupling capacitors; and an analog to digital converter (ADC) coupled to the low pass filter.

Crystal oscillator interconnect architecture with noise immunity

A self-equalizing interconnect in a connector is installed in a microelectronic device. The self-equalizing interconnect is formed of a plurality of electrically conductive layers under conditions to offset skin-effect losses with respect to frequency change during operation. Each successive layer is configured to with the next highest electrical conductivity and subsequent electrically conductive films gradually decrease in electrical conductivity. In an embodiment, thickness of the conductive film adjacent the reference plain is configured thinnest and subsequent films are added and are seriatim gradually thicker. The highest electrically conductive film is configured closest to a reference plane in the connector, and the lowest electrically conductive film is farthest from the reference plane.

Multiple-layer, self-equalizing interconnects in package substrates

Apparatus and methods are provided for ameliorating distortion issues associated with a conductor that passes over a void in a reference plane. In an example, the conductor can include a first part routed over a major surface of a first side of the reference plane structure and that approaches a first edge of the reference plane structure with a first trajectory, a second part routed over the major surface of a second side of the reference plane structure and that approaches a second edge of the reference plane structure with a second trajectory in-line with the first trajectory, and a third portion connecting the first portion with the second portion and having a third trajectory departing from the first trajectory and the second trajectory, the third portion configured to span the void.

Transmission line design with routing-over-void compensation

Apparatus and methods are provided for ameliorating distortion issues associated with a conductor that passes over a void in a reference plane. In an example, the signal conductor can include a first part routed over the major surface of a first side of the reference plane structure on a first side of the void and that approaches a first edge of the reference plane structure with a first trajectory, a second part routed over the major surface of the reference plane structure on a second side of the void and that approaches a second edge of the reference plane structure with a second trajectory, and a third portion connecting the first portion with the second portion, the third portion spanning the void, and having a plurality of spurs extending from a body of the third portion.

Routing-over-void-T-line-compensation

An electrical interconnect for an electronic package. The electrical interconnect includes a first dielectric layer; a second dielectric layer; a signal conductor positioned between the first dielectric layer and the second dielectric layer; and a conductive reference layer mounted on the first dielectric layer, and wherein the conductive reference layer does not cover the signal conductor. The conductive reference layer may be a first conductive reference layer and the electrical interconnect further comprises a second conductive reference layer mounted on the second dielectric layer. The second conductive reference layer does not cover the signal conductor. In addition, the signal conductor may be a first signal conductor and the electrical interconnect may further include a second signal conductor between the first dielectric layer and the second dielectric layer. The first and second signal conductors may form a differential pair of conductors.

Electrical interconnect for a flexible electronic package

A logic-based decoder recovers binary data from ternary Crosstalk-Harnessed Signaling (CHS) streams with lower part cost, complexity and power consumption than analog/digital converter (ADC)-based CHS decoders. The decoders use inverters, latches, gates, latching circuits, and one comparator per bit pair to carry out the decoding calculations to produce a reconstructed binary signal with very low crosstalk noise that is largely insensitive to routing density. System-on-chip, multi-chip package, printed circuit board, and wired network applications are discussed.

Logic-based decoder for crosstalk-harnessed signaling

In some embodiments a high speed interconnect includes a layer of FR4 material, a trench in the layer of FR4 material, and a pair of transmission lines located near the trench. The trench is filled with a homogenous material. Other embodiments are described and claimed.

Method of forming a high speed interconnect

An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.

Shifted segment layout for differential signal traces to mitigate bundle weave effect

A method according to one embodiment identifying the frequency range of at least one active channel of at least one wireless communication RF band; identifying the frequency range of at least one clock harmonic; identifying an overlap, in whole or in part, between the frequency range of the at least one active channel and the frequency range of the at least one clock harmonic; and shifting a fundamental frequency of the at least one clock to shift the frequency range of the at least one clock harmonic out of, at least in part, the frequency range of the at least one active channel. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Managing system clocks to reduce RFI

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Hillsboro, OR, United States of America

Stephen H Hall