Amkor Technology, Inc.

Stephen Gregory Shermer

Jeffrey Alan Miks

Maximilien d'Estries

Curtis Michael Zwenger

Thomas P Glenn

Vincent DiCaprio

Frank Joseph Juskey

Anthony LoBianco

Brenda Gogue

James Kent Heckman

A circuit module for use in a memory card. The circuit module comprises a base substrate including a plurality of contacts. Attached to the base substrate is a memory die, while attached to the memory die is an interposer having a plurality of terminals electrically connected to each other in a prescribed pattern. At least one of the terminals is electrically connected to at least one of the contacts. Attached to the interposer is a controller die, with the memory die and the controller die each being electrically connected to at least one of the terminals of the interposer.

Interposer for interconnecting components in a memory card

A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts of the insert. A body covers the die pad and the semiconductor die and partially covers the insert such that the contacts are exposed in an exterior surface of the body.

Memory card ESC substrate insert

A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A layer of tape is applied to the leadframe such that the tape covers at least portions of the top contact surfaces of the contacts, at least portions of the top tie bar surfaces of the tie bars, and at least a portion of the top dambar surface of the dambar. Thereafter, the tie bars are removed from the leadframe. At least one semiconductor die is then electrically connected to the leadframe, with a body thereafter being formed on the leadframe such that the semiconductor die and the tape are covered by the body and the bottom contact surfaces are exposed in an exterior surface thereof.

Tape supported memory card leadframe structure

A placement template and method for placing optical dies provides an alternative to large-die implementation for microelectromechanical systems (MEMS). Multiple dies are aligned by a template mounted on the substrate. Apertures in the template receive the dies and protrusions at the edges of the apertures guide the dies during mounting. The protrusions may be tapered having a narrow end farthest from the substrate to provide self-alignment of the dies as they are placed. The template may be epitaxially grown from a semiconductor material on either the substrate or a backing layer. The template may also be etched, stamped or otherwise formed from a metal or ceramic layer. A separate template may be bonded to a ceramic or other substrate by an eutectoid bond, providing carefully controlled template placement on the substrate.

Placement template and method for placing optical dies

This invention provides a method for making a semiconductor package with stacked dies that substantially reduces risk of fracturing of the dies and prevents breakage of the wire bonds caused by wire sweep. One embodiment of the method includes the provision of a substrate and a pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed out to the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured and the second die is wire bonded to the substrate. A bead of an adhesive is dispensed around the periphery of the dies such that it covers the wire bonds and bonding pads on the second die. A plastic body is molded over the dies and the bead of adhesive. The bead of adhesive prevents bending or breakage of the wire bonds caused by wire sweep during the subsequent molding operation.

Growing community of inventors

Chandler, AZ, United States of America

Stephen Gregory Shermer