National Semiconductor Corporation

Stephen Gee

Luu Thanh Nguyen

Ken Pham

William Paul Mazotti

Bruce Carlton Roberts

Jia Liu

Peter Deane

John P Briant

Nikhil Vishwanath Kelkar

Jitendra Mohan

Hau Thanh Nguyen

Alan Erik Segervall

The claimed invention relates to structures suitable for improving the performance and reliability of electrical connectors. One embodiment of the claimed invention includes an integrated circuit die having an electrical contact coupled with electrically conductive paths that share a common electrical source. The conductive paths are configured to transmit the same electrical signal to the electrical contact, which supports an electrical connector, such as a solder bump. The electrical connector couples the die with an outside component, such as a circuit board. Each of the conductive paths connect to the electrical contact at different interface locations. When the electrical signal passes through the interface locations, the paths are configured to have non-zero current densities at those locations. The electrical resistance of the conductive paths may be substantially similar. Thus, instead of being concentrated at a single point, current is more evenly distributed along the junction between the die and solder bump, which may reduce voiding and localized heating.

Conductive paths for transmitting an electrical signal through an electrical connector

Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. It is particularly well adapted for use with vertical cavity surface emitting lasers (or laser arrays) and detectors (or detector arrays). In some embodiments, at least the cathode of the photonic device is soldered directly to a cathode pad on the base substrate. Similarly, in some embodiments, the semiconductor chip assembly is electrically connected to the base substrate by direct soldering. Specific base substrate structures are disclosed as well.

Ceramic optical sub-assembly for optoelectronic modules

The invention discloses an electrical interconnect with minimal parasitic capacitance. In one embodiment, an apparatus comprises a semiconductor substrate, and first and second support structures formed on the substrate, where the second support structure at least partially surrounds the first support structure on the substrate. The first and second support structures are each configured to support an electrical connector to be formed over the first and second support structures on the substrate.

Electrical interconnect with minimal parasitic capacitance

The invention comprises a connector apparatus for electrically interconnecting a chip sub-assembly to an optical sub-assembly. The apparatus includes a connector sleeve with a chip sub-assembly having at least one electrical connection arranged thereon. The connector sleeve is suitable for receiving a connector plug that includes an optical fiber optically coupled to the photonic devices of an optical sub-assembly that includes electrical connectors. The connector plug is engaged with the connector sleeve, thereby electrically interconnecting the electrical connections of the chip sub-assembly to the electrical connectors of the optical sub-assembly such that electrical signals can pass between the chip sub-assembly and a photonic device of the optical sub-assembly.

Electrical connector for opto-electronic modules

Electro-optical packages that embed the electronics of the packages directly to the optical cabling, provide short electrical connection paths for high performance, and that provide a robust interconnects. A first electro-optical package includes an integrated circuit and a connector sleeve configured to receive a plug-in optical assembly from the underside of the PC board. The plug-in optical assembly includes a backing piece and an opto-electric device mounted onto the backing piece. An electrical connection is provided between the opto-electric device and a contact location on the backing piece and a contact is provided between the contact location on the backing piece and the integrated circuit. With a second electro-optical package, an integrated circuit having an active surface facing in a first direction and an opto-electric device having contact points facing a second direction are provided. The integrated circuit and the opto-electric are positioned with respect to one another such that a direct electrical connection can be formed between the active surface of the integrated circuit and the contact points of the opto-electrical device.

Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards

An integrated circuit device comprising a semiconductor die having a plurality of conductive pads. Over the conductive pads is formed a passivation layer that has a plurality of passivation layer openings. The passivation layer openings are positioned over an associated one of the conductive pads. Barrier base pads are placed in electrical contact with the conductive pads such that a portion of each of barrier base pads cover at least the perimeter of each passivation layer opening. Each of the barrier base pads prevents cracks from propagating through the integrated circuit device. In another aspect of the invention, the integrated circuit device is attached to an external substrate by connecting the contact bumps to the bond pads on an electronic substrate. In yet another aspect of the invention, a method for manufacturing the integrated circuit device is described.

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Danville, CA, United States of America

Stephen Gee