Other

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Dow Global Technolgoies LLC

Stephen G Pisklak

Jeffrey James Hendron

Narayan Ramesh

Michael J Lesniak

David L King

The present invention provides a chemical mechanical (CMP) polishing pad with a top surface, one or more apertures adapted to receive an endpoint detection window, an underside having a recessed portion and having one or more flanged endpoint detection windows (windows), each window having a flange adapted to fit snugly into the recessed portion of the underside of the polishing layer, the flange having a thickness slightly less than the depth of the recessed portion of the polishing layer (to allow for adhesive), having a detection area that fits snugly into an aperture in the polishing layer so that its top surface that lies substantially flush with the top surface of the polishing layer.

Flanged optical endpoint detection windows and CMP polishing pads containing them

A decorative sink apron with curved corners. The exposed portion of the apron has brackets attached thereto and a decorative cover is secured to the brackets.

Decorative sink apron

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Wilmington, DE, United States of America

Stephen G Pisklak