Microsemi Corporation

Stephen G Kelly

Tracy A Autry

Christopher Alan Barnes

George A Digiacomo

Tracy Autry

The present invention comprises a process of mixing a luminous substance in powder form to a transferable grade molding compound in a pelletized or powder form, such as a clear epoxy, to derive a homogeneous mixture that can be pressed and sintered into solid pellets. The solid pellets are further processed so as to permit their deposition on and around a light emitting semiconductor driver so as to obtain a white light emitting semiconductor device. This white light emitting device can be used in a variety of lighting applications.

Method of fabricating a light-emitting device (LED) utilizing powder/pelletized homogeneously mixed molding compound

A low profile, 1 or 2 die design, surface mount high power microelectronic package with coefficient of expansion (CTE) matched materials such as Silicon die to Molybdenum conductor (bond pads). The CTE matching of the materials in the package enables the device to withstand repeated, extreme temperature range cycling without failing or cracking. The package can be used for transient voltage suppression (TVS), Schottky diode, rectifier diode, or high voltage diodes, among other uses. The use of a heat sink metal conductor that has a very high modulus of elasticity allows for a very thin wall plastic locking to be utilized in order to minimize the footprint of the package.

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Melrose, MA, United States of America

Stephen G Kelly