International Business Machines Corporation

Stephen G Gonya

James K Lake

Randy C Long

Roger N Wild

Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.

Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium

A high solidus temperature, high service temperature, high strength multi-component solder alloy having a major portion of Sn and effective amounts of Sb, Bi and Cu.

Lead-free, tin, antimony, bismtuh, copper solder alloy

Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally with Bi.

High temperature, lead-free, tin based solder composition

The lead free alloy is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 weight percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancing third component. The third component can be Cu, In, Ag, and combinations of Cu and Ag.

Lead free, tin-bismuth solder alloys

Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight % Ag, 9.8 weight % Bi, and 9.8 weight % In.

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Endicott, NY, United States of America

Stephen G Gonya