Eastman-kodak Company

Stephen F Bond

John Andrew Lebens

Antonio Cabal

A thermal actuator for a micro-electromechanical device is disclosed. The thermal actuator includes a base element and a movable element extending from the base element and residing at a first position. The movable element includes a barrier layer constructed of a barrier material having low thermal conductivity material, bonded between a first layer and a second layer; wherein the first layer is constructed of a first material having a high coefficient of thermal expansion and the second layer is constructed of a second material having a high thermal conductivity and a high Young's modulus. An apparatus is provided adapted to apply a heat pulse directly to the first layer, causing a thermal expansion of the first layer relative to the second layer and deflection of the movable element to a second position.

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Oakton, VA, United States of America

Stephen F Bond