Emc Corporation

Dell Products Inc.

Emc IP Holding Company LLC

Stephen Edward Strickland

Steven D Sardella

John Victor Burroughs

Douglas Sullivan

Joseph P King

Mickey Steven Felton

Bernard Warnakulasooriya

Timothy Dorr

Ralph C Frangioso, Jr

Alex J Sanville

Bassem N Bishay

Jeffrey Michael Lewis

Lawrence J Feroli

Jason Pritchard

Maida Boudreau

Brian Daniel Kennedy

Kevin Warren Mundt

Jeffrey Alan Brown

Phillip John Roux

Daniel Dufresne

Ryan Cartland McDaniel

David C Bisbee

Thomas J Connor

James Creighton Tryhubczak

Phillip H Leef

Adrianna D Bailey

James L Pringle, Jr

John Blondin

Shawn Joel Dube

Albert F Beinor, Jr

Thomas N Dibb

Daniel Alvarado

Michael John Kozel

Michael A Faulkner

Charles W Ziegler, Iv

Jason J Leone

Rizwan Sheikh

John Phinney

Philip J Roux

Charles William Ziegler

Alan McIlvene

Dor Aharony

Michael Alexander Raineri

Gary W Smith

An apparatus, including: a chassis, including a track; a midplane assembly, including: a connector; and locking mechanisms, wherein the midplane is coupled to the chassis; wherein when a first pluggable module is coupled to the connector of the midplane assembly, first rails of the first pluggable module are engaged with the track of the chassis and the locking mechanisms engage the chassis to place the first pluggable module in a first position with respect to the chassis, wherein when a second pluggable module is coupled to the connector of the midplane assembly, second rails of the second pluggable module are engaged with the track of the chassis and an extension of each of the second rails engages respective locking mechanisms to disengage the respective locking mechanisms from the chassis such that the midplane assembly is translatable with respect to the chassis to a second position differing from the first position.

Apparatus for adjustable depth of a module within a chassis

A power delivery system, including: a computing module having: a top surface including a first contact pad; a rail system including a first rail, wherein the first rail includes: a first end opposite to a second end; a first slot extending between the first end and the second end of the first rail, the first slot including a first surface positioned opposite to a second surface, the first surface of the first rail including a first contact finger; wherein, when the computing module is coupled to the rail system: the top surface of the computing module contacts the first surface of the first slot such that the first contact pad of the computing module contacts the first contact finger of the first rail to transfer power from a first power cable through the first contact finger to the first contact pad of the computing module.

Power delivery system

A build on-demand chassis with a universal bay system that can be assembled into different configurations to support different system requirements from end users includes positionable partitions and a bay support assembly for each set of devices. A controller communicates with a microcontroller unit (MCU) in each bay support assembly to determine a slot identifier and a type of device supported by the bay support assembly to provide greater flexibility in what configurations are possible. When a processor in the information handling system sends an instruction for a type of device, the controller knows the location and capabilities of the device and manages the communication.

Universal bay chassis and system for self-identification and automatic configuration of an information handling system in the chassis

A computing card for an information handling system, the computing card system including a computing card, including: a first side including: a first body surface, the first body surface including a first plurality of conductive pads configured to connect respectively with a first set of pins of a computing card receptacle; a first indented surface configured to connect with a second set of pins of the computing card receptacle; a first connecting surface defined between the first body surface and the first indented surface; a bottom surface; and a plurality of internal layers, wherein one or more of the internal layers are exposed at the first indented surface, and are connected to the bottom surface.

Computing card system with accessible internal layers and edge interconnects for an information handling system

A floating connector assembly for an information handling system includes a first float bracket and a connector. The first float includes a bar. The connector includes a first receptacle and a first compressible component. The first compressible component is placed in physical communication with the bar of the first float bracket. In response to a force exerted on the connector, a region of the first compressible component is compressed. The connector floats with respect to the first float bracket in a direction of the force exerted on the connector.

Floating auto-centering cable connector assembly

A fan carrier system, including a fan carrier, including: a fan apparatus having i) a first end positioned opposite to a second end, and ii) a first side positioned opposite to a second side, the first and the second side extending between the first end and the second end; a first piston coupled to the fan apparatus, the first piston positioned along the first side, the first piston translatable between the first end and the second end; a connection assembly coupled to a first end of the first piston, the connection assembly including a first connector; a handle assembly, including: a first arm coupled to the first piston via a first handle pin, the first arm further including a first carrier pin; a handle coupled to the first arm; a chassis, including: a first wall and a second wall each including a respective slot.

Fan carrier system for an information handling system

A computing chassis, including: a first storage processor assembly; a second storage processor assembly; a first midplane, wherein the first storage processor assembly and the second storage processor assembly are coupled concurrently to the first midplane; and a second midplane, wherein the first storage processor assembly and the second storage processor assembly are coupled concurrently to the second midplane, wherein communication between the first storage processor assembly and the second storage processor assembly is through the first midplane and the second midplane independently.

Computing chassis including removeable midplanes

An information handling system includes first and second printed circuit boards (PCBs), and first and second connectors. The first PCB includes a first top surface, a first bottom, and a first plurality of side surfaces extending between the first top and first bottom surfaces. The first connector is embedded within the first PCB, and extends from the first bottom surface toward the first top surface. A first height of the first connector is substantially equal to a first thickness of the first PCB. The second PCB includes a second top surface, a second bottom, and a second plurality of side surfaces extending between the second top and second bottom surfaces. The second connector is embedded within the second PCB, and extends from the second bottom surface toward the second top surface. A second height of the second connector is greater than a second thickness of the second printed circuit board.

Information handling system with a printed circuit board having an embedded interconnect

Identifying a first controller and a second controller each connected to a computing device over a first serial bus for monitoring of the computing device; allocating, at the first controller, i) a first internal register bit of a first register indicating an arbitration status of the first controller with respect to the computing device and ii) a second internal register bit of the first register indicating an arbitration status of the second controller with respect to the computing device; allocating, at the second controller, i) a third internal register bit of a second register indicating the arbitration status of the first controller with respect to the computing device and ii) a fourth internal register bit of the second register indicating the arbitration status of the second controller with respect to the computing device.

Arbitrating serial bus access

A non-volatile memory express (NVMe) based storage system may include a processor; an input/output (I/O) port operatively coupled to a data network; a drive interface board (DIB), including: a PCIe switch communicatively coupled to the processor to receive signals from the processor to a plurality of NVMe storage devices; and a source clock communicatively coupled to the PCIe switch; a connector communicatively coupling the DIB to relay clock signals to a plurality of NVMe drives at a drive mid-plane baseboard; the drive mid-plane baseboard communicatively coupled to the source clock, the drive mid-plane baseboard including: a clock distribution module to receive a source clock signal from the source clock, the clock distribution modules placed at the drive baseboard to distribute the clock signals to the plurality of NVMe storage devices.

Systems and methods for optimizing clock distribution in NVMe storage enclosures

Systems and methods are disclosed that may include identifying a first coefficient of thermal expansion for a first component, the first component including component pins having a first pitch value; identifying a second coefficient of thermal expansion for a second component, the second component associated with electrically conductive pads; determining a relative expansion value based on the first coefficient of thermal expansion and the second coefficient of thermal expansion; determining a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by a soldering process; and determining a second pitch value for the electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the component pins and the electrically conductive pads during the soldering process.

System and method for compensating for thermal expansion caused by soldering process

A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.

Circuit board assembly

A storage device mounting system includes a cage assembly configured to receive one or more storage devices. A pivot assembly is configured to pivotally attach the cage assembly to a chassis assembly. A flexible conductor assembly is configured to electrically couple the one or more storage devices to a system board assembly while allowing the cage assembly to pivot with respect to the chassis assembly.

Storage device mounting system

An adapter assembly includes an adapter board. A first connector assembly is coupled to the adapter board and is configured to releasably electrically couple the adapter board to a high-availability IT component. A second connector assembly is coupled to the adapter board and is configured to releasably couple the adapter board to a non-hot-swappable industry standard expansion card. The adapter board includes hot swap logic configured to enable the non-hot-swappable industry standard expansion card to function as a hot-swappable industry standard expansion card.

Hot-swappable adapter system for non-hot-swappable expansion cards

Growing community of inventors

Marlboro, MA, United States of America

Stephen Edward Strickland