Sdcmaterials, Inc.

Intel Corporation

Exxonmobil Research and Engineering Company

University of Florida Research Foundation Inc

Stephen Edward Lehman, Jr

Maximilian A Biberger

Qinghua Yin

Robert Matthew Kevwitch

Jesudos J Kingsley

Saikumar Jayaraman

James Chris Matayabas, Jr

Kenneth Boone Wagener

Donald N Schulz

Leonel R Arana

Daewoong Suh

Lisa Saunders Baugh

Enock Berluche

Mukul P Renavikar

Rahul N Manepalli

Vijay Wakharkar

Wendy Chan

Jason A Smith

Garrett W Oakley

A metal catalyst is formed by vaporizing a quantity of metal and a quantity of carrier forming a vapor cloud. The vapor cloud is quenched forming precipitate nanoparticles comprising a portion of metal and a portion of carrier. The nanoparticles are impregnated onto supports. The supports are able to be used in existing heterogeneous catalysis systems. A system for forming metal catalysts comprises means for vaporizing a quantity of metals and a quantity of carrier, quenching the resulting vapor cloud and forming precipitate nanoparticles comprising a portion of metals and a portion of carrier. The system further comprises means for impregnating supports with the nanoparticles.

Method and system for forming plug and play metal catalysts

Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

Thermoset polymides for microelectronic applications

A metal compound catalyst is formed by vaporizing a quantity of catalyst material and a quantity of carrier thereby forming a vapor cloud, exposing the vapor cloud to a co-reactant and quenching the vapor cloud. The nanoparticles are impregnated onto supports. The supports are able to be used in existing heterogeneous catalysis systems. A system for forming metal compound catalysts comprises means for vaporizing a quantity of catalyst material and a quantity of carrier, quenching the resulting vapor cloud, forming precipitate nanoparticles comprising a portion of catalyst material and a portion of carrier, and subjecting the nanoparticles to a co-reactant. The system further comprises means for impregnating the of supports with the nanoparticles.

Method and system for forming plug and play metal compound catalysts

An oxide catalyst is formed by vaporizing a quantity of at least one precursor material or catalyst material thereby forming a vapor cloud. The vapor cloud is quenched forming precipitate nanoparticles. The nanoparticles are impregnated onto supports. The supports are able to be used in existing heterogeneous catalysis systems. A system for forming oxide catalysts comprises means for vaporizing a quantity of at least one precursor material or at least one catalyst material, quenching the resulting vapor cloud and forming precipitate nanoparticles. The system further comprises means for supports with the nanoparticles.

Method and system for forming plug and play oxide catalysts

A method of removing oxide from metallic powder. The method comprises: providing a powder defined by a plurality of particles, each particle in the plurality of particles having a metallic core and an oxide layer surrounding the metallic core; etching the plurality of particles, wherein the oxide layer is removed from each particle in the plurality of particles, leaving only the metallic core; coating each particle in the etched plurality of particles with an organic layer; dispersing the etched plurality of particles; and providing the powder as dispersed particles that are absent an oxide layer surrounding the metallic core, each metallic core being coated with an organic layer. The steps of etching, coating and dispersing are performed in situ with the plurality of particles disposed in liquid, absent any exposure of the metallic cores to air.

In situ oxide removal, dispersal and drying

A method of removing silicon-dioxide from silicon powder. The method comprises: providing a silicon powder defined by each particle having a silicon core and a silicon dioxide layer surrounding the silicon core; dispersing the particles in a dispersing solution; adding an etching solution, wherein the etching solution removes the silicon dioxide layer; adding an organic solvent, thereby producing an organic phase and an aqueous phase, the organic phase comprising the silicon cores and the organic solvent, and the aqueous phase comprising the dispersing solution, the etching solution, and the etching by-products; coating each silicon core with an organic material; draining out the aqueous phase; washing the organic phase, wherein the remaining material from the aqueous phase is removed; and providing the silicon powder as a plurality of silicon cores each absent a silicon dioxide layer and having an organic coating.

In situ oxide removal, dispersal and drying for silicon SiO2

A method for removing copper-oxide from copper powder, the method comprising: providing a copper powder defined by each particle having a copper core and a copper-oxide layer surrounding the copper core; disposing the particles in an etching solution in a container, wherein the etching solution removes the copper-oxide layer from each particle; decanting the etching solution and by-products; washing the particles; disposing the washed particles in an organic solvent; coating each copper core with an organic material from the organic solvent; dispersing the particles in the organic solvent; and providing the copper powder as dispersed copper cores that are absent a copper-oxide layer and have an organic coating, wherein the steps of dispersing in the etching solution, decanting, washing, disposing in the organic solvent, coating, and dispersing are performed in situ with the plurality of particles disposed in liquid, absent any exposure of the copper cores to air.

In situ oxide removal, dispersal and drying for copper copper-oxide

A method of making catalysts includes loading a quantity of catalyst material and quantity of carrier in into a plasma gun in a desired ratio and vaporizing the catalyst material and carrier in a reaction chamber, thereby forming a vapor cloud. The vapor cloud is quenched in a quench chamber to form solid nanoparticles, wherein the quench chamber comprises a frusto-conical body having a wide end, a narrow end, and a quench region formed between the wide end and the narrow end, and a reactive mixture inlet configured to receive the vapor cloud and to supply the vapor cloud into the quench region in the direction of the narrow end. The quench chamber further includes at least one conditioning fluid inlet configured to supply a conditioning fluid into the quench region in the direction of the narrow end. The nanoparticles are bonded to supports.

Thermoset polyimides for microelectronic applications

A metal compound catalyst is formed by vaporizing a quantity of catalyst material and a quantity of carrier thereby forming a vapor cloud, exposing the vapor cloud to a co-reactant and quenching the vapor cloud. The nanoparticles are impregnated onto supports. The supports are able to be used in existing heterogeneous catalysis systems. A system for forming metal compound catalysts comprises components for vaporizing a quantity of catalyst material and a quantity of carrier, quenching the resulting vapor cloud, forming precipitate nanoparticles comprising a portion of catalyst material and a portion of carrier, and subjecting the nanoparticles to a co-reactant. The system further comprises components for impregnating the supports with the nanoparticles.

Growing community of inventors

Chandler, AZ, United States of America

Stephen Edward Lehman, Jr