Digital Equipment Corporation

Stephen E Lindquist

Richard E Olson

Samuel Hammond Duncan

Charles R Barker, Iii

Colin E Brench

Douglas A Bailey

Massimo Hartsarich

Stephen Richard Coe

Robert S Sobolewski

David A Cease

An interface module for an electronic system that permits signals to pass between a high frequency main circuit board area such as used for central processing units, memories, or other relatively high clock rate components and a low frequency circuit area such as used for standard peripheral circuit modules used for disk drives, video interfaces and the like. The interconnect module is positioned near an opening in a sheet metal bulkhead used as an electromagnetic interference (EMI) barrier around the main circuit area. The interface module uses a connector that is surrounded by one or more conductive shields that contain metal fingers on inboard and outboard sides to provide a ground connection between the interface module and the EMI barrier.

Interface that permits data bus signals to pass between high frequency

A fan heatsink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly includes a blower mounted on top of a specially shaped heatsink, the heatsink having a truncated hyperbolic shaped central member, with fins radially emanating from the center. The blower draws air in through the area between the fins, up the curved central portion and into the blower assembly where it is then exited out the sides of the fan. The fins may be smooth or textured, straight or curved. The fan heatsink assembly is attached to the device to be cooled. Heat is transferred from the electronic component, into the heat dissipating member where the fan causes air to be drawn up between the fins and along the curved center portion, removing heat from the heat dissipating member and the electronic component.

High performance fan heatsink assembly

An apparatus is disclosed for fluid dynamically augmenting a heat sink to displace a boundary layer in the cooling fluid adjacent to the surfaces of the heat sink cooling fins. Ribs with a thickness slightly less than the thickness of the boundary layer cause secondary flow in the cooling fluid downstream from the rib in the form of vortices which displace hotter slower moving fluid by drawing in cooler fluid farther from the surface of the fins. The ribs are constructed on the surface of the cooling fins in an inverted V-shaped configuration. The angle of the ribs in the inverted V-shaped configuration is optimized to intersect the entire flow of the fluid through the heat sink forming a means for efficient dissipating heat from the heat sink over its entire surface area.

Apparatus for an air impingement heat sink using secondary flow

Growing community of inventors

Boylston, MA, United States of America

Stephen E Lindquist