General Electric Company

Stephen Daniel Nash

Howard Ross Edmunds

Robert Gregory Wagoner

James Patrick Lyons

Steven Wade Sutherland

Christopher Todd Moore

Albert Andreas Esser

John Earl Bittner

Paul Stephen Pate

Christopher James McMenamin

Benjamin Arthur Niemoeller

Andrew Gordon Phillip

John Springer Harrison

Michael L Miller

Lyle Thomas Keister

Patrick Henry McGinn

Brian Matthew Alken

Melvin La Hughes

Conrad Angelo Pecile

A power electronics assembly for a power generation system includes a housing and an attenuator card positioned within the housing. The attenuator card may include at least one printed circuit board for a high-voltage attenuator circuit. The power electronics assembly also includes a potting material at least partially filling the housing on one or more sides of the attenuator card, a detachable end cap positioned at a first end of the housing, and multi-phase wiring communicatively coupled to the high-voltage attenuator circuit through the end cap.

Power electronics assembly having a potted high voltage attenuator card for a wind turbine

A method and apparatus for an air core reactor including a plurality of straight members and a plurality of offset members, the plurality of straight and offset members are interconnected to form an orthogonal spiral having an air core therethrough.

Fabricated air core reactor

A system for temperature control of an electronic component includes a heat plate supporting the component; a heat plate temperature sensor; a fan capable of providing air for cooling the heat plate; and a fan control for using the heat plate temperature to control the operation of the fan to provide a substantially constant heat plate temperature. The system can further include a heat pipe assembly having fins and coupled to the heat plate with the fan capable of providing air to the fins. The heat pipe assembly can include at least two heat pipes each having first ends coupled to the heat plate and second ends situated in a condensation section where at least one of the heat pipes has a different working fluid than an other. A switch temperature or load current sensor can be coupled to the heat plate and supply data to a switch controller for receiving the switch temperature, determining whether the temperature or load current has changed, and adjusting a switching frequency of the at least one electronic switch device in response to any change of the switch temperature. A bus layer can be situated adjacent the component and selectively coated with an insulating material and studs can mechanically and electrically coupling the bus layer and a printed circuit board to the component. An insulating shield can be situated between the bus layer and the printed circuit board with the studs.

Temperature control of electronic components

Growing community of inventors

Salem, VA, United States of America

Stephen Daniel Nash