Thomas & Betts International LLC

Tyco Electronics Corporation

Augat Inc.

Texas Instruments Corporation

Cyrix Corporation

Stephen D DelPrete

Peter David Wapenski

Donald Santos

John Lincoln Grant

Austin S O'Malley

Thomas D Selgas

Luis A Sousa

Sean T Crowley

Steven B Wakefield

Emanuel D Torti

Kerry D Arnold

Thomas W Galligan

David M Barnum

Jonathan W Goodwin

David R Crotzer

Andrew H Strange

Jeffrey Walter Mason

Donald Phillip Amaral, Jr

Michael L Kirkman

Shiraz Sameja

Arthur G Michaud

William R Arsenault

Steven R Corbesero

Don Santos

Steven Wakefield

A heat sink retention module for an electronic device includes a base comprising mounting lugs configured to be mounted to a circuit board, and frame elements extending between the mounting lugs to define at least one keep out area interior to the frame elements and at least one keep out area exterior to the frame elements. The frame elements include at least one frame element extending at an oblique angle to another of the frame elements, and heat sink retention posts extend vertically upward from the frame elements.

Processor heat sink retention module and assembly

A connector for board-to-board or board-to-socket interconnect applications includes a plurality of conductive elastomeric columnar contacts surrounded by an insulative body. In one embodiment employed in board-to-board applications, the columnar contacts are substantially longer than wide to facilitate mounting of components between opposed boards. The conductive columnar contacts extend slightly beyond the surfaces of the insulative body. The body may include integral raised collars that surround opposing ends of the conductive columnar contacts and at least one stop flange integral with the body that limits overstress on tips of the conductive columnar contacts.

Conductive elastomeric contact system

A connector for board-to-board and board-to-device interconnect applications includes a plurality of conductive elastomeric columnar contacts arranged in a contact array and retained in a first plurality of openings in an insulative substrate and a plurality of stops retained in a second plurality of openings in the insulative substrate. The stops are dispersed among the contacts of the contact array or positioned on the periphery of the contact array and located in non-abutting relation with respect to adjacent contacts. The contacts and the stops have opposing end surfaces and the end surfaces of the contacts are located a greater distance from the substrate than the end surfaces of the stops such that the stops limit the compression of the elastomeric contacts when the connector is disposed in its intended mounting orientation.

Conductive elastomeric contact system with anti-overstress columns

A connector for board-to-board and board to device interconnect applications includes a plurality of conductive elastomeric columnar contacts surrounded by respective insulative support columns. The elastomeric columnar contacts extend through holes in an insulative subtrate. The insulative support columns have opposing end surfaces disposed on opposite sides of a substrate and end surfaces of the columnar contacts are located at a distance from the substrate slightly greater than the distance between the substrate and the support column end surfaces. Insulative intermediate columns serve a mechanical stops that resist further compression of the elastomeric contacts and the support columns when the connector is subjected to excessive axial compressive forces. The intermediate columns have opposing end surfaces on opposing sides of the substrate that are spaced from the substrate a distance less than the support column end surfaces.

A socket for a BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of a BGA package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes latch elements for retaining the contact assembly on the frame. The socket is mounted onto a printed circuit board which has an array of contact areas corresponding to the array of resilient contacts of the socket. A BGA package is placed onto the socket frame and the package is maintained in alignment on the frame such that the ball contacts engage the respective contacts of the contact assembly of the socket. The package is retained in the socket by a retention mechanism. The socket can include elements for preventing overstress of the resilient contacts.

Socket for BGA packages

A leadless IC or other electronic circuit package socket is provided which is of simple construction providing low profile mounting of an IC package on a circuit board. The socket comprises a relative thin socket carrier having a plurality of resilient conductive columns extending between the top and bottom surfaces of the carrier and having alignment elements which are cooperative with elements on a circuit board on which the carrier is mounted to position the carrier on the circuit board such that the conductive columns are in registration and electrical contact with corresponding ones of contacts on the circuit board. An IC package or other circuit package has contacts on the bottom surface thereof in a pattern corresponding to the pattern of the resilient conductive columns of the socket carrier, and also has alignment elements cooperative with elements on the socket carrier to provide alignment of the package contacts and the conductive columns when the package is mounted on the socket carrier. A cover fits over the IC package and has snap fittings which engage cooperative openings or other elements of the circuit board to retain the IC package in electrical engagement with the circuit board via the socket carrier.

Leadless IC socket

An edge clip is disclosed for electrically connecting a conductive pad on the surface of a printed circuit board or its edge to an external connector. The edge clip is substantially U-shaped, with first and second opposing, non-parallel sides defining a space therebetween. For connection, the printed circuit board edge is fitted into the space such that the opposing sides provide spring-like deflective force against the pad and the printed circuit board, thereby providing a more reliable connection. The edge clip may include an alignment feature for facilitating alignment prior to soldering. The alignment feature may include small projections formed on the edge clip to align with, and fit into, holes on the print circuit board. Scored sections may be disposed on one edge of the clip to facilitate removal of the edge clip from a carrier during assembly. Further, the edge clip may include a center beam extending away from one of the opposing surfaces to provide contact with another metallic surface, such as a miniature card case, thereby providing additional grounding capabilities which can provide protection against static discharge.

Miniature card edge clip

A board-to-board interconnect socket (40) provides electrical interconnection between printed circuit boards (50, 52). Resilient metalized particle interconnects (28) are disposed in holes in a rigid substrate (14) of desired thickness. Each resilient interconnect (28) includes first and second cap members (18, 20) that extend from opposing ends of the hole and beyond the respective surfaces of the substrate. The first and second cap members (18, 20) may be connected with a stem member (22) or conductive paste (34) that is disposed inside the hole. The hole may be lined with conductive material (26) such as conductive plating to facilitate conduction of electricity.

Board to board interconnect

An interface connector which facilitates connection between a miniature card and a host device is disclosed. The interface connector includes an elastomeric connection device, an insulating body and electrical contacts. The elastomeric connection device and electrical contacts provide electrical pathways between corresponding pads and contacts (e.g., data, power and ground) on the miniature card and the host. The insulating body is adapted to be received by the host and to receive the miniature card, and includes a castellated side wall which protects the elastomeric connection device from foreign objects. The insulating body also includes location pins which facilitate proper insertion and alignment of the connector with regard to the host device. A keying feature is provided to prevent insertion of incompatible miniature cards. A write protect feature is disclosed for use with writable miniature cards. A combined latch-card detection switch is also disclosed.

Miniature card interface connector

A component carrier and mating system is disclosed for aligning and mating closely spaced leads of integrated circuit (IC) packages, which protects the integrated circuit packages and permits easy installation. The system is particularly adapted for aligning and mating integrated circuits which have high pin counts. A carrier assembly aligns for mating and interconnecting at least two integrated circuit packages having a plurality of leads extending from the packages. A protective shroud covers the stacked packages to maintain the packages in electrical and mechanical engagement and to assure that no damage occurs to the integrated circuit packages. In one embodiment, a first package is installed on the carrier assembly and coupled with the protective shroud to form a pre-engagement assembly, the pre-engagement assembly is then engaged with a second package mounted on a printed circuit board. An extraction tool facilitates disengagement of the assembly from the second package mounted on the printed circuit board.

Stackable interconnection socket

A component carrier and mating system is disclosed for aligning and mating closely spaced leads of integrated circuit (IC) packages, which protects the integrated circuit packages and permits easy installation. The system is particularly adapted for aligning and mating integrated circuits which have high pin counts. A carrier assembly (100) aligns for mating and interconnecting at least two integrated circuit packages (102a, 102b) having a plurality of leads extending from the packages. A protective shroud (101) covers the stacked packages to maintain the packages in electrical and mechanical engagement and to assure that no damage occurs to the integrated circuit packages. In one embodiment, a first package is installed on the carrier assembly and coupled with the protective shroud to form a pre-engagement assembly, the pre-engagement assembly is then engaged with a second package mounted on a printed circuit board. Resilient latches (534) on the protective shroud deflect to engage bumpers (210) on the second package to maintain the assembly on the circuit board. An extraction tool facilitates disengagement of the assembly from the second package mounted on the printed circuit board.

A leadless component socket comprises a one- or two-piece leadless component contact socket assembly having a plurality of holes with a respective plurality of spring contacts disposed therein. The socket assembly includes a finger slot or slots to facilitate the manual removal of a chip carrier from the socket and a bias clip and integral keyed corner for assuring proper alignment of the chip carrier with the contacts of the socket assembly. The socket further comprises a cover, a cover support, an insulator assembly and a backup plate or other fastening means for supporting the socket on a printed circuit board. The socket assembly can be configured with a variety of contact terminal ends adapted for a desired mode of circuit board interface. A variety of cover configurations are also accommodated and disclosed.

High density grid array socket

A low insertion force connector has conductors blanked and formed from metal strip materials and disposed in openings in an insulating connector body. A receptacle portion of each conductor has a bridge formed to extend around the perimeter of a square and disposed inside a body opening and has integral leaf springs extending from the bridge at the respective sides of the square toward a terminal entry end of the opening so that two pairs of the springs are disposed in facing relation around a common axis for receiving a terminal therebetween. The contact surfaces of one pair of springs is relatively closer to the entry end of the body opening than the contact surfaces of the other pair of springs so that a terminal being inserted moves the pairs of springs separately in establishing said spring forces, thereby requiring lesser terminal insertion forces. An integral gauge strip on each conductor is connected to one pair of the springs and extends to define the perimeter of a gauge opening for limiting the cross-section of a terminal which can be inserted between the leaf springs through the gauge aperture. Opposite ends of the gauge strips are preferably interconnected by dove-tail means for positively fixing the perimeter of the gauge aperture.

Growing community of inventors

Rehoboth, MA, United States of America

Stephen D DelPrete