Intel Corporation

Stephen Christianson

Konika Ganguly

Kemal Aygun

George Vergis

Xiang Li

Dong-Ho Han

Stephen H Hall

Jun Liao

Emile Davies-Venn

Xiaopeng Dong

Kirankumar Kamisetty

M Reza Zamani

Landon Hanks

Cory Mason

An embodiment of an electronic apparatus comprises a circuit board, one or more memory devices affixed to a top side of the circuit board, and one or more board-to-board connectors affixed to a bottom side of the circuit board to provide an external connection to signals of the one or more memory devices, where the one or more board-to-board connectors are located inward from outermost edges of the circuit board and where a first footprint defined by an outermost boundary of the one or more board-to-board connectors is substantially a same size as or smaller than a second footprint defined by an outermost boundary of the one or more memory devices. Other embodiments are disclosed and claimed.

Low power memory module

Techniques for fabricating a package substrate and/or a stiffener for a semiconductor package are described. For one technique, a package substrate comprises: a routing layer comprising a dielectric layer. A stiffener may be above the routing layer and a conductive line may be on the routing layer, the conductive line comprising first and second portions, the first portion having a first width, the second portion having a second width, the conductive line extending from a first region of the routing layer to a second region of the routing layer, the first region being under the stiffener, the second region being outside the stiffener, the first portion being on the first region, and the second portion being on the second region. One or more portions of the conductive line can be perpendicular to an edge of the stiffener. The perpendicular portion(s) may comprise a transition between the first and second widths.

Stiffener and package substrate for a semiconductor package

Growing community of inventors

Tigard, OR, United States of America

Stephen Christianson