General Electric Company

Lockheed Martin Corporation

Stephen Charles Miller

Richard D Clark

John A Windyka

Eric L Holzman

Richard Joseph Teti

Leonard H Yorinks

Bradley David Dufour

John A MacDonald

A hermetically sealed housing (10) includes a dielectric end portion (118) which provides a transmission-line feedthrough between a printed-circuit such as HDI and exterior connections. A first transmission line (1) on the PC board (30) transitions to a 3-via transmission line (4), which transitions to a third coplanar, microstrip, or stripline transmission line (3). The third transmission line (3) transitions to a second 3-via transmission line (5), which ends at a coplanar transmission line (2) which is outside the housing.

Hermetic feedthrough using three-via transmission lines

The transition interconnects microstrip transmission lines whose finite-width conductors are formed on the upper surface and whose ground planes are formed on the under surface of a ceramic substrate. A patternable metallizable multilayer thick film dielectric is applied to the under surface of the ceramic substrate. The transition comprises first and second vias which penetrate the ceramic substrate inside and outside a hermetic enclosure. The upper ends of the vias are connected to the finite-width transmission line conductors, and the lower ends of the vias are interconnected by a finite-width conductor formed on the under surface of the substrate. The lower conductor then forms a transmission line of either a microstrip or coplanar nature with a ground plane available on the underside of the assembly. The thick film dielectric facilitates sealing, and attachment of a metal base plate. All steps are performed using thick film processing.

Hermetically sealed microstrip to microstrip transition for printed

Growing community of inventors

Haddonfield, NJ, United States of America

Stephen Charles Miller