3m Innovative Properties Company

Fsi International, Inc.

Stephen C Loper

Thomas J Wagener

Gary M Palmgren

Bruce A Sventek

Tracy A Gast

William D Joseph

Samad Javid

David G Baird

Christopher N Loesch

The present disclosure provides abrasive articles that include an abrasive layer having a contact surface, a first layer coupled to the abrasive layer, and a second layer coupled to the first layer. The first layer is configured to provide contact pressure to the abrasive layer, such as through a higher hardness than the second layer. The second layer is configured to provide conformability to the abrasive layer, such as through a higher compressibility than the first layer. The resulting abrasive articles may exert a consistent contact pressure against a substrate with increased conformability around the substrate, reduced hysteresis, improved removal rate consistency, and/or improved lifetime over abrasive articles that do not use the multiple layer construction described above.

Conformable abrasive article

Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.

Polishing pads including phase-separated polymer blend and method of making and using the same

Improved methods of rinsing and drying microelectronic devices by way of an immersion processing apparatus are provided for effectively cleaning microelectronic devices. Methods and arrangements control the separation of one or more microelectronic devices from a liquid environment as part of a replacement of the liquid environment with a gas environment. Cleaning enhancement substance, such as IPA, is introduced into the gas environment according to a controlled profile while the separation step is conducted. The controlled profile being directed to the timing of introduction of cleaning enhancement substance, the concentration of cleaning enhancement substance and/or flow rates thereof into the vessel. Controlled timing of gas and cleaning enhancement substance delivery can also improve effectiveness of separation. Methods and arrangements are also provided for controlling a drying step to be conducted on the one or more microelectronic devices after they have been separated from a liquid environment by replacing the liquid environment with a gas environment. Preferably, an arrangement of gas distribution devices create one or more drying gas curtains, which gas curtains may be controllably directed with respect to a set of microelectronic devices to provide optimal drying of the microelectronic devices after being separating from a liquid.

Microelectronic device drying devices and techniques

Growing community of inventors

Eden Prairie, MN, United States of America

Stephen C Loper