Siemens Medical Solutions Usa, Inc.

Stephen C Englund

David A Petersen

Sevig Ayter

Charles Dale Emery

Gregg W Frey

Xiaocong Guo

Todor Sheljaskow

Grazyna M Palczewska

Ron Ho

Thomas G Houck

Martina Vogt

One or more chips, integrated circuits, or semiconductors are embedded within a backing block. Planar sheets of backing material are formed with integrated circuits within holes in the sheets. Traces connect the integrated circuit to electrodes or exposed conductive surfaces. A plurality of the planar sheets may be manufactured using wafer processing, such as pick and place of chips in a wafer of backing material and IC redistribution for forming the traces. The different sheets are cut from the wafer and stacked adjacent each other. The transducer connects with the exposed electrodes or conductive surfaces of the backing.

Embedded circuits on an ultrasound transducer and method of manufacture

A multi-dimensional transducer array has pitch along one dimension less than the pitch along a second dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer.

Multi-dimensional transducer arrays and method of manufacture

A method of manufacturing multiple dimension transducer arrays of multiple layer elements from modules is provided. A plurality of multiple layer strips are formed. The strips are separate, such as an elongated strip corresponding in size to one row of elements. Connections between the electrodes of various layers or separate connections from the various electrodes to a bottom of the strip are formed on the separate multiple layer strips. The separate strips are then aligned within a frame and bonded together. The resulting sheet of multiple layer transducer material is then diced to form elements. Due to the previous interconnection of electrodes, each element includes electrical connections for each of the layer electrodes, avoiding the need for vias or high aspect ratio sputtering.

Multi-layer multi-dimensional transducer and method of manufacture

Growing community of inventors

Bellevue, WA, United States of America

Stephen C Englund