Globalfoundries Inc.

Stephen Bradley Miner

William John Fosnight

Stephanie Waite

Ryan John Gallagher

John Robinson

Isaac Sarek Banner

A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication

Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

System and method for monitoring wafer handling and a wafer handling machine

Automated mechanical handling systems (AMHS) for integrated circuit fabrication, system computers programmed for use in the AMHSs, and methods of handling a wafer carrier having an inlet port and an outlet port are provided. An exemplary method of handling the wafer carrier includes providing a plurality of carrier storage positions that are adapted to receive the wafer carrier. The carrier storage positions include a presence sensor and a gas nozzle. The wafer carrier is loaded into one of the carrier storage positions. The presence of the wafer carrier in the carrier storage position is sensed with the presence sensor. A malfunction in gas flow through the inlet port is identified in the carrier storage position that contains the wafer carrier. The wafer carrier is relocated to another carrier storage position in response to identifying the malfunction.

Automated mechanical handling systems for integrated circuit fabrication, system computers programmed for use therein, and methods of handling a wafer carrier having an inlet port and an outlet port

A system for separately handling different size FOUPs includes an end effector having a surface thereon for supporting a FOUP. The end effector and surface is configured to support different size FOUPs. A fixture or means for engaging and maintaining a FOUP, of different size FOUPs, included to position and maintain each of a different size FOUP on the end effector during transport thereof. A shelf is configured to receive each of said different size FOUPs. The end effector is thus capable of transporting either a first size FOUP or a second, smaller size FOUP.

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Gansevoort, NY, United States of America

Stephen Bradley Miner