Amoco Corporation

Union Carbide Corporation

Stephen B Rimsa

James E Harris

Robert Barclay, Jr

Robert J Cotter

Herbert S Chao

Lloyd Mahlon Robeson

Louis M Maresca

George T Kwiatkowski

George A Salensky

Cotter, Robert J

This invention is directed to a molded electrical device comprising an electrically conductive pathway and an insulating material, and capable of interconnecting with external circuitry said insulating material comprising a blend of a particular amorphous polymer and a particular crystalline thermoplastic polymer. Also, this invention is directed to a composition suitable for use as an insulating material in an electrical device comprising from about 35 to about 65 weight percent of an amorphous polymer selected from a polyarylethersulfone resin, a polyarylether resin, a polyetherimide or a polyarylate, and from about 65 to about 35 weight percent of a crystalline polymer selected from a poly(arylene sulfide), a polyester or a polyamide.

Molded electrical device and composition therefore

Described herein is a composite structure comprising a dielectric substrate surface with an electrically conductive layer or pathway thereon. The pathway comprises a thermoset resin and sufficient electrically conductive metal, in the configuration of an electric circuit element, to provide desired properties and direct solderability. Direct solderability is achieved without plating the electric circuit element. It has a low surface resistivity, preferably less than 10 m ohm per square. Also described are conductive, thixotropic inks for printed circuit devices which include silver powder and silver flake in its composition. A thixotropic adhesive for bonding the electric circuit element to the dielectric substrate surface is also taught. A method for making the composite structure is further disclosed.

Method of making solderable printed circuits formed without plating

Described herein are circuit board substrates prepared from certain poly(aryl ethers) based on 4,4'-dichlorodiphenyl sulfone.

Novel poly(aryl ethers) useful for molding into a circuit board substrate

Described are select polyarylethersulfones polymers which are useful for molding into a circuit board substrte. When metal is electroplated onto such a substrate, there is a high degree of adhesion of the metal to the circuit board.

Polymer useful for molding into a circuit board subtrate

Described herein are novel poly(aryl ethers) based on 2,5-di-t-butylhydroquinone. These poly(aryl ethers) have excellent high temperature, oxidative and chemical resistance, as well as good melt-fabricability.

Novel poly(aryl ethers)

New polyarylethersulfone circuit board substrates

Polyarylether sulfones useful for molding into a circuit board substrate

Circuit board substrates prepared from poly(aryl ether)s which contain repeating units derived from bis-(3,5-dimethyl-4-hydroxyphenyl) sulfone (TMBS) exhibit adequate glass transition temperatures (Tg), acceptable plateability and acceptable resistance to water absorption.

Growing community of inventors

Lebanon, NJ, United States of America

Stephen B Rimsa