Skorpios Technologies, Inc.

Other

Emcore Corporation

Stephen B Krasulick

John M Dallesasse

Timothy Creazzo

Amit Mizrahi

Elton Marchena

Guoliang Li

John Y Spann

Derek Van Orden

Damien Lambert

John Zyskind

Majid Sodagar

Robert J Stone

William J Kozlovsky

Murtaza Askari

Kalpit Jha

Luca Cafiero

Paveen Apiratikul

Nikhil Kumar

Andrew Bonthron

Wenyi Wang

Changyi Li

Yi Wang

Samir Desai

Kumar Satya Harinadh Potluri

A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

Heterogeneous bonding for photonic integration

A polarization-independent, optical circulator is formed in silicon photonics. The polarization-independent, optical circulator uses an optical splitter having two couplers and two waveguides joining the two couplers. One of the two waveguides is thinner than the other to create a large effective index difference between TE and TM modes transmitted through the one waveguide. Polarization rotators, including reciprocal and/or non-reciprocal rotators, are further used to create the optical circulator.

Monolithically-integrated, polarization-independent circulator

A semiconductor laser device is provided. The semiconductor laser device includes: a substrate having a first facet; a guiding layer having a second facet through which an output light is configured to be emitted; a bottom dielectric layer between the substrate and the guiding layer; and a top dielectric layer on the guiding layer. The second facet is at an angle relative to the first facet.

Wafer-level etched facet for perpendicular coupling of light from a semiconductor laser device

A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening, such that the active region of the chip is aligned with the device layer of the platform.

Integration of an unprocessed, direct-bandgap chip into a silicon photonic device

A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.

Integrated waveguide coupler

An optical bandpass filter includes an optical splitter having at least four ports, one of the ports being designated as an input port and one of the ports being designated as an output port. First and second reflectors couple with respective third and fourth ones of the ports. The splitter directs portions of the input light from the input port, into the third and fourth ports, such that the portions of the input light propagate toward the respective first and second reflectors. The first and second reflectors reflect light having wavelengths within a predetermined wavelength range, back toward the splitter, as wavelength-selected light, and transmit light having wavelengths that are outside of the predetermined wavelength range, away from the splitter. The splitter directs at least a portion of the wavelength-selected light that propagates back toward the splitter, into the output port, as output light.

Optical bandpass filter based on reflective devices

Heterogeneous substrate bonding for photonic integration

A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.

On-chip high capacitance termination for transmitters

Photonic rotators integrated on a substrate are disclosed for manipulating light polarization.

Systems and methods for photonic polarization rotators

A photonic die includes an optical component that can emit output light. The optical component includes a substrate having a length and width that are substantially greater than a thickness thereof, the thickness defining a vertical direction. The optical component includes a vertical edge, and a reflective or antireflective coating on the vertical edge, wherein the reflective or antireflective coating includes a silicon-based material.

Wafer level coatings for photonic die

A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermetically seals the chip in the platform.

Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.

Multilevel template assisted wafer bonding

A device is provided for optical mode spot size conversion to optically couple a semiconductor waveguide with an optical fiber. The device includes a waveguide comprising a waveguide taper region, which comprises a shoulder portion and a ridge portion above the shoulder portion. The ridge portion has a width that tapers to meet a width of the shoulder portion. The waveguide taper region comprises a first material. The device also has a mode converter coupled to the waveguide. The mode converter includes a plurality of stages, and each of the plurality of stages tapers in a direction similar to a direction of taper of the waveguide taper region. The mode converter is made of a second material different from the first material.

Growing community of inventors

Albuquerque, NM, United States of America

Stephen B Krasulick