Applied Materials, Inc.

Stephen A Wells

Simon Yavelberg

Zubin Huang

Ramesh Gopalan

Gangadhar Sheelavant

Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head.

Chemical mechanical polishing smart ring

In a power control apparatus for controlling power supply of an ion source having an indirectly headed cathode, the cathode bias power supply which provides a bias potential between the filament and cathode has an output that is effected by changes in impedance of the electron flow in the region between the filament and the cathode. Such impedance changes can arise due to changes in the chemistry of materials in this region, changes in gas pressure or physical changes, for example. A bias supply controller in the power control apparatus maintains the output power of the cathode bias power supply unit at a desired level, thus not effected by changes in impedance of the electron flow between the filament and the indirectly heated cathode.

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West Sussex, United Kingdom

Stephen A Wells