Cisco Technology, Inc.

Stephen A Scearce

Phong Hoang Ho

Subramanian Ramanathan

Goutham Sabavat

Linda W Scott

Shadi Ebrahimi Asl

Javid Mohamed

Torence Lu

Shawn Emory Bender

David Phillip Tarkington

William Jeffrey Lewis

Ming Chi Chen

Robert Arthur Loose

Lwin O Tint

James Everett Grishaw

Helen Shtargot

Rene Duzac

Quinn Bonard Gaumer

Kimberly Rae Turner

Joel Richard Goergen

Victor D Liu

Terri LaBelle Cruse

Dattatri N Mattur

Yang Tang

Feng Wu

Yongchao Ji

Shunjia Liu

Pongsak Sriwudhthanun

Shaochun Tang

James C Q Tran

Louis Smidt

Kadin Stephens

A method of manufacturing a printed circuit board (PCB) includes arranging a first trace segment of a trace on a substrate of the PCB, the substrate being composed of fiber glass strands that define a fiber glass weave pattern, and arranging a second trace segment of the trace on the substrate at a position that is fractionally offset from the first trace segment along an axis by a distance that is less than a ball grid array (BGA) pitch of a BGA based on the fiber glass weave pattern. The BGA pitch is a separation distance along the axis between a center of a first via of the BGA of the PCB and a center of a second via of the BGA.

Trace arrangement for printed circuit board

A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed circuit board having a top exposed surface and a bottom exposed surface, a first trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, a second trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, and first electrical components and second electrical components disposed on the top exposed surface of the multilayer printed circuit board and associated, respectively, with the first trace and via structure and the second trace and via structure, wherein the first electrical components are mounted orthogonally with respect to the second electrical components.

Interlaced crosstalk controlled traces, vias, and capacitors

In one embodiment, an apparatus includes a connecting member configured for positioning on an upper surface of an integrated circuit package and a cable comprising a first end attached to the connecting member and a second end configured for electrically coupling with a power supply component. The connecting member is operable to position the cable for connection to the upper surface of the integrated circuit package to deliver power from the power supply component to the integrated circuit package with the power supply component and the integrated circuit package mounted on an upper surface of a printed circuit board. A method is also disclosed herein.

Apparatus and method for direct power delivery to integrated circuit package

A multi-column graphite-over-foam (GOF) assembly includes a plurality of foam columns wherein each foam column of the plurality of foam columns are individually wrapped in a graphite sheet. A graphite layer surrounds the plurality of foam columns and an electrically conductive outer layer surrounding the graphite layer. The graphite layer is configured to thermally couple the electrically conductive outer layer to the plurality of foam columns, and the electrically conductive outer layer is configured to absorb electromagnetic interference (EMI).

Multi-column graphite-over-foam assembly

In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.

Current redistribution in a printed circuit board

Various implementations disclosed herein include arrangements that reduce parasitic inductance associated with a discrete decoupling capacitor by using a three-terminal capacitor and a staggered array of power supply and ground connections. In some implementations, a capacitive decoupling arrangement includes a substrate, an array of electrical vias of first and second types, and a capacitive arrangement on one side of the substrate coupled to the array of electrical vias. The array of electrical vias includes a first type of vias and a second type of vias. The capacitive arrangement is coupled between two respective vias of the first type of vias and two respective vias of the second type of vias on the first planar surface of the substrate. The capacitive arrangement includes a plurality of capacitive elements electrically arranged in parallel between the two respective vias of the first type of vias and the two respective vias of the second type of vias.

Decoupling capacitive arrangement to manage power integrity

A network device includes card slots and Network Module slots that be reconfigured to hold cards and network modules having different form factors.

Slot adapter for reconfiguring slots in a network device

A router includes WIC and Network Module slots that be reconfigured to hold cards and network modules having different form factors. A motherboard/midplane arrangement provides for a field replaceable motherboard that can be replaced without removing the router from the rack.

Router with field replaceable motherboard

A cable device includes an integrated surge protection circuit. In the event that, communication signals conveyed by the cable include (potentially damaging) transient voltages, the surge protection circuit integrated in the cable suppresses the transient voltages at a distance from a corresponding electronic circuit to which the cable is attached. Consequently, potentially damaging voltage transients imparted on the communication signals are clamped before reaching potentially sensitive inputs of the electronic circuit.

Methods and apparatus to protect against voltage surges

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Apex, NC, United States of America

Stephen A Scearce