Lucent Technologies Inc.

Triquint Semiconductor Corporation

Stephen A Neston

Kurt George Steiner

Taeho Kook

Alan Sangone Chen

Edward Alois Rietman

Timothy Daniel

A SAW device having metal electrodes on a surface of the piezoelectric substrate includes a dielectric layer deposited on the surface. Depositing the layer results in seams extending upward from the electrodes extending above the surface of the substrate. An additional seam results from one seam extending from one electrode joining a second seam extending from an adjacent electrode within the dielectric layer and is generally formed above the height of the electrodes. The additional seam is removed through planarization or the like. The dielectric layer may be further planarized for providing a thickness of the dielectric layer above the electrodes as desired.

Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor

The present invention provides a polishing apparatus comprising a carrier head, rigid members coupled to the carrier head at different points on the carrier head, and a controller coupled to each of the rigid members wherein the controller is configured to regulate forces applied against the carrier head through each of the rigid members.

Carrier head with controllable struts for improved wafer planarity

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Orlando, FL, United States of America

Stephen A Neston