Lucent Technologies Inc.

Tyco Electronics Logistics Ag

Stephen A Ferranti

Leon Klafter

Madhu Ganesa-Pillai

John Paul Mello

Alan Michael Lyons

Jin He

Michael Clyde Steeves

Steven John Vargo

Jeffrey Linn Bream

Gregory P Jorgenson

Joanne C Zhang

Mark A Haisler

Amanda C Reeves

Stephen C Frazier

An apparatus for effecting electrical connection between a power source and equipment includes: (a) a first conductor having a first aperture; (b) a second conductor having a second aperture; (c) an insulator having a connecting bore coaxial with the first and second apertures to establish a bridging passage extending a bridging distance to traverse the first conductor, the insulator and the second conductor when assembled with the first conductor and the second conductor substantially parallel separated by the insulator; and (d) a bridge having an axial length at least equal with the bridging distance and a transaxial dimension less than the passage diameter and having a first engagement structure in the first aperture and a second engagement structure in the second aperture when the bridge is engaged; the bridge is removable from engagement to interrupt electrical connection between the power source and the equipment.

Apparatus and method for effecting electrical connection between a power source and equipment

A housing for a power supply rectifier includes an enclosure having front and rear panels, top and bottom walls, and side walls. A bracket is attached to the enclosure and includes a plurality of projections for mating with a plurality of apertures contained in one or more of the walls of the enclosure. The projections are larger than the apertures, such that when pressure is applied to the bracket, the projections are forced into the apertures to form a seal to minimize EMI emissions from the enclosure. The bracket removably mounts a fan to the housing.

Bracket assembly with enhanced EMI containment

The present invention provides for a heat sink that, in a particularly advantageous embodiment, includes a heat sink body with a spine configured to be oriented parallel with the direction of air flow when the heat sink is coupled to a substrate. The heat sink further includes a first set of cooling fins that are coupled to and extend from the spine along a first common longitudinal axis. At least two of the first set of cooling fins laterally extend from the first common longitudinal axis in a common direction and in an offset relationship to each other.

Heat sink with offset fin profile

The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m&deg; C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.

Heatsink with high thermal conductivity dielectric

Growing community of inventors

Rowlett, TX, United States of America

Stephen A Ferranti