Motorola Corporation

Stephanie Schauer

Robert W Pennisi

Steven C Machuga

An improved encapsulant for an electronic component package is composed of an inorganic powder dispersed in a polycyanurate resin binder. The encapsulant is formed by applying a curing mixture of the powder and a liquid vehicle composed predominantly of a blend of one or more multifunctional cyanate ester compounds that are curable to form the binder. The blend includes a cyanate ester substituted bisphenol derivative compound having the formula ##STR1## wherein R.sub.1 and R.sub.2 are members of the group consisting of hydrogen, methyl and ethyl. Preferably, the blend includes a second cyantophenylene compound having the formula ##STR2## wherein R.sub.3 is a hydrocarbon chain including an aryl link.

Growing community of inventors

Rolling Meadows, IL, United States of America

Stephanie Schauer