International Business Machines Corporation

Stephanie Allard

Daniel Mark Dreps

Kirk David Peterson

Jon Alfred Casey

Steven Paul Ostrander

Sungjun Chun

Brian W Quinlan

Charles L Reynolds

Sylvain Pharand

Pascale Gagnon

Jean Labonte

Kevin Drummond

David Edward Turnbull

Jean-Francois Bachand

Denis Blanchard

Charles Leon Arvin

Thomas J Brunschwiler

Thomas Edward Lombardi

Kenneth Charles Marston

Steve Ostrander

Marcus E Interrante

Catherine Dufort

Luca Del Carro

Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.

Multicomponent module design and fabrication

An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.

Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste

A structure with controlled capillary coverage is provided and includes a substrate including one or more first contacts, a component and adhesive. The component includes one or more second contacts and a rib disposed at a distance from each of the one or more second contacts. The component is disposed such that the one or more second contacts are communicative with the one or more first contacts and corresponding surfaces of the substrate and the rib face each other at a controlled gap height to define a fill-space. The adhesive is dispensed at a discrete point whereby the adhesive is drawn to fill the fill-space by capillary action.

Structure with controlled capillary coverage

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St-Hyacinthe, Canada

Stephanie Allard