Intel Corporation

Stephanie A Bojarski

Aaron D Lilak

Anh Phan

Gilbert W Dewey

Ravi Pillarisetty

Willy Rachmady

James S Clarke

Hubert C George

Ehren Mannebach

Patrick R Morrow

Hui Jae Yoo

Richard E Schenker

Roman Caudillo

Lester Lampert

Jeanette M Roberts

Nicole K Thomas

David J Michalak

Thomas Francis Watson

Tahir Ghani

Mauro J Kobrinsky

Jeffery D Bielefeld

Biswajeet Guha

Kevin Lai Lin

Manish Chandhok

Sarah Atanasov

Orb Acton

Babita Dhayal

Rishabh Mehandru

Charles Henry Wallace

Cheng-Ying Huang

Leonard P Guler

Florian Gstrein

Rami Hourani

Paul Anton Nyhus

Roza Kotlyar

Eungnak Han

Sudipto Naskar

Kanwaljit Singh

Marie Krysak

Satyarth Suri

Tristan A Tronic

Nafees Kabir

Urusa Alaan

Patrick H Keys

Gurpreet Singh

Jasmeet S Chawla

Brennen Karl Mueller

Michael Harper

Colin T Carver

Sam Sivakumar

Jessica M Torres

Payam Amin

Myra McDonnell

Florian Luethi

Stephen D Snyder

Eric M Henry

Achala Bhuwalka

Jeffrey D Bielefeld

Samuel Frederick Neyens

Integrated circuit structures having partitioned source or drain contact structures, and methods of fabricating integrated circuit structures having partitioned source or drain contact structures, are described. For example, an integrated circuit structure includes a fin. A gate stack is over the fin. A first epitaxial source or drain structure is at a first end of the fin. A second epitaxial source or drain structure is at a second end of the fin. A conductive contact structure is coupled to one of the first or the second epitaxial source or drain structures. The conductive contact structure has a first portion partitioned from a second portion.

Integrated circuit structures having partitioned source or drain contact structures

Disclosed herein are lateral gate material arrangements for quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack; and a gate above the quantum well stack, wherein the gate includes a gate electrode, the gate electrode includes a first material proximate to side faces of the gate and a second material proximate to a center of the gate, and the first material has a different material composition than the second material.

Lateral gate material arrangements for quantum dot devices

Backside contact structures include etch selective materials to facilitate backside contact formation. An integrated circuit structure includes a frontside contact region, a device region below the frontside contact region, and a backside contact region below the device region. The device region includes a transistor. The backside contact region includes a first dielectric material under a source or drain region of the transistor, a second dielectric material laterally adjacent to the first dielectric material and under a gate structure of the transistor. A non-conductive spacer is between the first and second dielectric materials. The first and second dielectric materials are selectively etchable with respect to one another and the spacer. The backside contact region may include an interconnect feature that, for instance, passes through the first dielectric material and contacts a bottom side of the source/drain region, and/or passes through the second dielectric material and contacts the gate structure.

Backside contacts for semiconductor devices

Stacked transistor structures having a conductive interconnect between upper and lower transistors. In an embodiment, the interconnect is formed by first provisioning a protective layer over an area to be protected (gate dielectric or other sensitive material) of upper transistor, and then etching material adjacent and below the protected area to expose an underlying contact point of lower transistor. A metal is deposited into the void created by the etch to provide the interconnect. The protective layer is resistant to the etch process and is preserved in the structure, and in some cases may be utilized as a work-function metal. In an embodiment, the protective layer is formed by deposition of reactive semiconductor and metal material layers which are subsequently transformed into a work function metal or work function metal-containing compound. A remnant of unreacted reactive semiconductor material may be left in structure and collinear with protective layer.

Leave-behind protective layer having secondary purpose

Quantum dot devices with three of more accumulation gates provided over a single row of a quantum dot formation region are disclosed. Each accumulation gate is electrically coupled to a respective doped region. In this manner, multiple single electron transistors (SETs) are provided along the row. Side and/or center screening gates may be used to apply microwave pulses for qubit control and to control electrostatics so that source and drain regions of the multiple SETs with quantum dots formed along the single row of a quantum dot formation region are sufficiently isolated from one another. Such quantum dot devices provide strong spatial localization of the quantum dots, good control over quantum dot interactions and manipulation, good scalability in the number of quantum dots included in the device, and/or design flexibility in making electrical connections to the quantum dot devices to integrate the quantum dot devices in larger computing devices.

Quantum dot devices with side and center screening gates

Disclosed herein are quantum dot devices with multiple layers of gate metal, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack; an insulating material above the quantum well stack, wherein the insulating material includes a trench; and a gate on the insulating material and extending into the trench, wherein the gate includes a first gate metal in the trench and a second gate metal above the first gate metal.

Quantum dot devices with multiple layers of gate metal

An integrated circuit structure comprises a lower device layer that includes a first structure comprising a first set of transistor fins and a first set of contact metallization. An upper device layer is bonded onto the lower device layer, where the upper device layer includes a second structure comprising a second set of transistor fins and a second set of contact metallization. At least one power isolation wall extends from a top of the upper device layer to the bottom of the lower device layer, wherein the power isolation wall is filled with a conductive material such that power is routed between transistor devices on the upper device layer and the lower device layer.

Vertically stacked transistor devices with isolation wall structures containing an electrical conductor

Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack and a plurality of linear arrays of gates above the quantum well stack to control quantum dot formation in the quantum well stack. An insulating material may be between a first linear array of gates and a second linear array of gates, the insulating material may be between individual gates in the first linear array of gates, and gate metal of the first linear array of gates may extend over the insulating material.

Quantum dot devices

Disclosed herein are quantum dot devices with conductive liners, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include a base, a first fin extending from the base, a second fin extending from the base, a conductive material between the first fin and the second fin, and a dielectric material between the conductive material and the first fin.

Quantum dot devices with conductive liners

A stacked transistor architecture has a fin structure that includes lower and upper portions separated by an isolation region built into the fin structure. Upper and lower gate structures on respective upper and lower fin structure portions may be different from one another (e.g., with respect to work function metal and/or gate dielectric thickness). One example methodology includes depositing lower gate structure materials on the lower and upper channel regions, recessing those materials to re-expose the upper channel region, and then re-depositing upper gate structure materials on the upper channel region. Another example methodology includes depositing a sacrificial protective layer on the upper channel region. The lower gate structure materials are then deposited on both the exposed lower channel region and sacrificial protective layer. The lower gate structure materials and sacrificial protective layer are then recessed to re-expose upper channel region so that upper gate structure materials can be deposited.

Techniques for forming gate structures for transistors arranged in a stacked configuration on a single fin structure

Techniques are disclosed for non-planar transistors having varying channel widths (Wsi). In some instances, the resulting structure has a fin (or nanowires, nanoribbons, or nanosheets) comprising a first channel region and a second channel region, with a source or drain region between the first channel region and the second channel region. The widths of the respective channel regions are independent of each other, e.g., a first width of the first channel region is different from a second width of the second channel region. The variation in width of a given fin structure may vary in a symmetric fashion or an asymmetric fashion. In an embodiment, a spacer-based forming approach is utilized that allows for abrupt changes in width along a given fin. Sub-resolution fin dimensions are achievable as well.

Non-planar transistors with channel regions having varying widths

In some embodiments, a semiconductor device structure is formed by using an angled etch to remove material so as to expose a portion of an adjacent conductor. The space formed upon removing the material can then be filled with a conductive material during formation of a contact or other conductive structure (e.g., and interconnection). In this way, the contact formation also fills the space to form an angled local interconnect portion that connects adjacent structures (e.g., a source/drain contact to an adjacent source/drain contact, a source/drain contact to an adjacent gate contact, a source/drain contact to an adjacent device level conductor also connected to a gate/source/drain contact). In other embodiments, an interconnection structure herein termed a 'jogged via' establishes and electrical connection from laterally adjacent peripheral surfaces of conductive structures that are not coaxially or concentrically aligned with one another.

Self-aligned local interconnects

Growing community of inventors

Beaverton, OR, United States of America

Stephanie A Bojarski