Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique

Ulis

Lynred

Stephane Pocas

Jean-Jacques Yon

Geoffroy Dumont

Pierre Imperinetti

Laurent Carle

Hubert Moriceau

Sébastien Cortial

Salim Boutami

Eric Jalaguier

Norbert Moussy

Guy Feuillet

Patrick Leduc

Agnès Arnaud

Wilfried Rabaud

Ujwol Palanchoke

Jean-Francois Michaud

A method for producing a bolometric detector comprising producing a stack, on an interconnect level of a read-out circuit, comprising a sacrificial layer positioned between a carrier layer and an etch stop layer, the sacrificial layer comprising a mineral material; producing a conducting via passing through the stack such that it is in contact with a conducting portion of said interconnect level; depositing a conducting layer onto the carrier layer and the via; etching the conducting layer and the carrier layer, forming a bolometer membrane electrically connected to the via by a remaining portion of the conducting layer that covers an upper part of the via; and elimination of the sacrificial layer by selective chemical etching, and such that the membrane is suspended by the via.

Method for producing a bolometric detector

A device for detecting electromagnetic radiation, including a readout circuit, which is located in a substrate, and an electrical connection pad, which is placed on the substrate, including a metal section that is raised above the substrate and electrically connected to the readout circuit. The detection device furthermore includes a protection wall that extends under the raised metal section so as to define therewith at least one portion of a cavity, and what is called a reinforcing layer section that is located in the cavity and on which the raised metal section rests.

Device for detecting electromagnetic radiation comprising a raised electrical connection pad

A device for detecting electromagnetic radiation is provided, including a substrate; a matrix of thermal detectors disposed on the substrate; and a structure encapsulating the matrix of thermal detectors, including an encapsulating layer extending continuously around and above the matrix of thermal detectors so as to define with the substrate a cavity in which the matrix of thermal detectors is disposed, the encapsulating layer including at least one internal bearing section, which bears directly against the substrate between two adjacent thermal detectors of said matrix, said at least one internal bearing section including a sidewall and a peripheral wall, the sidewall being separate from the peripheral wall in a plane parallel to a plane of the substrate, and the peripheral wall encircling the matrix of thermal detectors.

Device for detecting radiation including an encapsulating structure having an improved mechanical strength

A device for detecting electromagnetic radiation, including a substrate; at least one thermal detector, placed on the substrate, including an absorbing membrane suspended above the substrate; and an encapsulating structure encapsulating the thermal detector, including an encapsulating layer extending around and above the thermal detector so as to define with the substrate a cavity in which the thermal detector is located; wherein the encapsulating layer includes at least one through-orifice that is what is referred to as an exhaust vent, each exhaust vent being placed so that at least one thermal detector has a single exhaust vent located facing the corresponding absorbing membrane, preferably plumb with the center of said absorbing membrane.

Device for detecting electromagnetic radiation possessing a hermetic encapsulating structure comprising an exhaust vent

A device for detecting electromagnetic radiation is provided, including a substrate; at least one thermal detector placed on the substrate; and an encapsulating structure encapsulating the detector, including a thin encapsulating layer of a material that is transparent to said radiation, extending around and above the detector so as to define with the substrate a cavity in which the detector is located; wherein the thin encapsulating layer comprises a peripheral wall that encircles the detector, and that has a cross section, in a plane parallel to the plane of the substrate, of square or rectangular shape, corners of which are rounded.

A bolometric detector of LWIR wavelengths, including:

Bolometric detector with MIM structures of different dimensions

An infrared detection device including an infrared heat detector and a connection pad each spaced apart from an etching stop layer by a non-zero distance substantially equal relatively to each other, wherein first and second electrically conducting vias are respectively electrically connected to first and second portions of a metal line of a penultimate level of electrical interconnections, and wherein an empty space formed in a first inter-metal dielectric layer surrounds the first electrically conducting via and extends under the infrared heat detector.

Method for making an infrared detection device

A method of sealing a first wafer and a second wafer each made of semiconducting materials, including: implanting a metallic species in at least the first wafer, assembling the first wafer and the second wafer by molecular bonding, and after the molecular bonding, forming a metallic ohmic contact including alloys formed between the implanted metallic species and the semiconducting materials of the first wafer and the second wafer, the metallic ohmic contact being formed at an assembly interface between the first wafer and the second wafer, wherein the forming includes causing the implanted metallic species to diffuse towards the interface between the first wafer with the second wafer and beyond the interface.

Method of sealing two plates with the formation of an ohmic contact therebetween

An assembly method to enable local electrical bonds between zones located on a face of a first substrate and corresponding zones located on a face of a second substrate, the faces being located facing each other, at least one of the substrates having a surface topography. The method forms an intermediate layer including at least one burial layer on the face of the substrate or substrates having a surface topography to make it (them) compatible with molecular bonding of the faces of substrates to each other from a topographic point of view, resistivity and/or thickness of the intermediate layer being chosen to enable the local electrical bonds, brings the two faces into contact, the substrates positioned to create electrical bonds between areas on the first substrate and corresponding areas on the second substrate, and bonds the faces by molecular bonding.

Growing community of inventors

Grenoble, France

Stephane Pocas