Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Centre National De La Recherche Scientifique

Tronic's Microsystems

Miyoshi Europe S.a.s.

Eveon

Stephane Nicolas

Xavier Baillin

Christian Pisella

Stephane Fanget

Pauline Bosmet

Sébastien Gougeon

Patrick Guenoun

Christophe Fajolles

Tetsuya Takahashi

For the cosmetic field, omniphobic cosmetic pigments under the form of a core shell structure: the core is or includes of a metal oxide on which is adsorbed poly(&#x3b2;-(1&#x2192;4)-D-glucosamine) chains; the chains being acetylated, or partially or totally deacetylated. Also, the process for manufacturing the omniphobic cosmetic pigments, including:

Process for manufacturing omniphobic cosmetic pigments

A packing structure including: a cap secured to at least one first substrate and forming at least one cavity between the cap and the first substrate; a layer of at least one first material permeable to a gas, arranged in the cap and/or in the first substrate and/or at the interface between the cap and the first substrate, and forming at least one part of a wall of the cavity; a portion of at least one second material non-permeable to said gas, the thickness of which is higher than or equal to that of the layer of the first material, and surrounding at least one first part of the layer of the first material forming said part of the wall of the cavity; an aperture passing through the cap or the first substrate and opening onto or into said part of the layer of the first material.

Package structure including a cavity coupled to an injection gas channel composed of a permeable material

Method for making an electrical connection in a blind via and electrical connection obtained

A method of encapsulating at least one microelectronic device is provided, including encapsulating the device in a cavity hermetically sealed against air, a cap of the cavity including at least one wall permeable to at least one noble gas; injecting the noble gas into the cavity through the wall permeable to the noble gas; hermetically sealing the cavity against air and the injected noble gas; forming the device on at least one first substrate; bonding at least one second substrate to the first substrate, thereby forming the cavity hermetically sealed against air, the wall permeable to the noble gas being formed by part of the second substrate; and forming, between the encapsulating and the injecting, at least one portion of material impermeable to the noble gas such that said portion partially covers the part of the second substrate that forms the wall permeable to the noble gas.

Method of encapsulating a microelectronic device

A process for encapsulating a microelectronic device, comprising the following steps:

Process for encapsulating a microelectronic device comprising injection of noble gas through a material permeable to this noble gas

A method for encapsulating at least one micro-device, comprising at least the following steps:

Method of encapsulating a micro-device by anodic bonding

The invention relates to a process for collective manufacturing of cavities and/or membranes (), with a given thickness d, in a wafer said to be a semiconductor on insulator layer, comprising at least one semiconducting surface layer with a thickness d on an insulating layer, this insulating layer itself being supported on a substrate, this process comprising:

Growing community of inventors

Meylan, France

Stephane Nicolas