Shipley Company LLC

Metakem Gesellschaft Fur Schichtchemie Der Metalle Mbh

M.p.c. Micropulse Plating Concepts

Learonal, Inc.

Micropulse Plating Concepts

Stephane Menard

James L Martin

David N Michelen

Michael P Toben

Mark Lefebvre

Leon Barstad

James E Rychwalski

Jörg Wurm

Lothar Schneider

Robert A Schetty, Iii

Leon R Barstad

Robert A Iii Schetty

The invention relates to an anode assembly for electroplating comprising (a) an anode body comprising soluble anode material and (b) a shielding covering at least part of the anode body and comprising a self-passivating metal electrically connected to the anode body and allowing electrolyte transport therethrough. The shielding comprises at least one layer of self-passivating metal having no openings larger than 2 mm, preferably 1 mm, in width or the shielding comprises at least two layers of self-passivating metal wherein the openings of at least one layer are at least partially covered by the metal of another layer. The invention also relates to a shielded anode basket, a method for electroplating and the use of the anode assembly and the shielded anode basket.

Anode assembly for electroplating

The present invention relates to an anode for electroplating, which has an anode base and a shield and is characterized in that additive degradation is reduced when it is used in electroplating.

Anode used for electroplating

The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Electrolytic copper plating method

The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.

Programmed pulse electroplating process

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Lyons, France

Stephane Menard