Telefonaktiebolaget Lm Ericsson (publ)

Stephane Lessard

Robert Frank Brunner

Qing Xu

Neng Liu

Martin Julien

Mehrdad Mir Shafiei

David V Plant

Mohamed Morsy-Osman

Francesco Testa

Wei-Ping Huang

Richard Joseph Brunner

Sergey Slovetskiy

Mats Johansson

Thang Hoang

Eslam El-Fiky

Mohammed Sowailem

Julie Dufort

A chip carrier socket for an electronic-photonic integrated-circuit (EPIC) assembly comprises a carrier bottom and a carrier top configured to mate to the carrier bottom while enclosing the EPIC assembly within an enclosed cavity. The carrier bottom comprises one or more conductive vias passing from a first surface of the carrier bottom to an opposite second surface of the carrier bottom, each conductive via providing electrical connectivity between an electrically conductive pad on the first surface of the carrier bottom and a respective electrically conductive pad, solder ball, or electrically conductive spring on the second surface of the carrier bottom. One or both of the carrier bottom and the carrier top comprises a fluid inlet port and a fluid outlet port. Further, either or both of the carrier bottom and the bottom top comprises an optical via passing from one surface to another of the carrier bottom or carrier top.

Chip-carrier socket for microfluidic-cooled three-dimensional electronic/photonic integrated circuits

A radio-frequency three-dimensional electronic-photonic integrated circuit (RF 3D EPIC) comprises a radio-frequency (RF) photonic integrated circuit (PIC) layer, the RF PIC layer comprising, in a single integrated circuit, at least one RF antenna and at least one photonic device coupling the RF antenna to an optical interface, and further comprises an electronic-photonic integrated circuit (EPIC) assembly optically coupled to the optical interface of the RF PIC layer, the EPIC assembly comprising two or more integrated-circuit dies bonded to one another so as to form a die stack, wherein at least one of the two or more integrated-circuit dies comprises one or more integrated photonic devices and wherein each of the two or more integrated-circuit dies is electrically connected to at least one other integrated-circuit die via an electrically conductive through-wafer interconnect or an electrically conductive through-wafer via.

Radio-frequency three-dimensional electronic-photonic integrated circuit with integrated antennas and transceivers

An optical modulation apparatus comprises first, second, and third optical modulators arranged so as to collectively modulate light coupled into a first optical input in all three dimensions of the three-dimensional Stokes vector space, to produce an optical output signal. The optical modulation apparatus further comprises a modulating circuit having a digital input configured to N generate first, second, and third modulating signals for driving the first, second, and third optical modulators so as to map digital data to an M-point optical constellation in the optical output signal. The points in the M-point optical constellation are distributed in the three-dimensional Stokes vector space such that the constellation figure of merit for the M-point optical constellation equals at least half of the maximum achievable constellation figure of merit for M points in the three-dimensional Stokes vector space.

Optimum three dimensional constellations for optical interconnects employing stokes vector receivers

According to an aspect, an optical system includes a laser diode configured to emit optical signals and at least two size-switchable broken racetrack ring resonators optically coupled to an optical waveguide, where each broken racetrack ring resonator is configured to exhibit a resonant wavelength. The optical system also includes a tuning arrangement associated with the broken racetrack ring resonators, where the tuning arrangement includes a micro electro-mechanical system (MEMS) or nano electro-mechanical system (NEMS) actuator mechanically coupled to a first portion of a first one of the broken racetrack ring resonators and configured to mechanically move the first portion so as to change the resonant wavelength of the first one of the broken racetrack ring resonators.

MEMS/NEMS integrated broken racetrack tunable laser diode

The disclosure relates to a transceiver operative to transmit and receive optical signals. The transceiver comprises a laser, a power splitter, a dual-polarization in-phase and quadrature modulator, DP-IQM, a first circulator (C, C), a second circulator (C, C), a first optical polarization controller, PC, a second optical polarization controller and a dual-polarization coherent receiver, DP-CRx. There is provided a system comprising a first transceiver and a second transceiver as described previously. The transceiver requires neither high speed DSP nor high resolution data converters to achieve 50 Gbaud DP-16 QAM, DP standing for dual polarization and QAM standing for quadrature amplitude modulation, yielding 400 Gb/s over 10 km below the 2.2&#xd7;10KP4 forward error correction (FEC) threshold.

DSP-free 'coherent lite' transceiver for next generation 1 lambda x 400G 10km optical intra-datacenter interconnects

An electronic-photonic integrated-circuit assembly comprises a carrier substrate () and one or more integrated-circuit dies () bonded to one another so as to form a die stack with exterior surfaces corresponding to an outer surface of a first one of the integrated-circuit dies and to an outer surface of a second one of the integrated-circuit dies, where at least one of the integrated-circuit dies includes one or more integrated photonic devices. One or more channels or passages () are formed into the outer surface of the first one of the integrated-circuit dies, and a first surface of the carrier substrate () is bonded to the outer surface of the first one of the integrated-circuit dies, thereby enclosing the one or more channels or passages (), The integrated-circuit dies are electrically connected to each other via electrically conductive through-wafer interconnects or electrically conductive through-wafer vias.

Stacked microfluidic cooled 3D electronic-photonic integrated circuit

There is provided a reconfigurable optical modulator comprising a light source and a splitter operative to receive an input signal from the light source and to split the input signal into a plurality of split signals. The optical modulator comprises a plurality of optical amplifiers, each being operative to receive one of the plurality of split signals as an input and to act as a switch having a first state where the split signal is blocked and a second state where the split signal is amplified. The optical modulator comprises a plurality of modulators, each being operative to receive an amplified split signal from one of the plurality of optical amplifiers and to modulate the amplified split signal into a modulated signal. The optical modulator comprises an optical combiner operative to combine a plurality of modulated signals produced by the plurality of modulators to thereby produce a modulated output signal.

Reconfigurable optical modulator

A small form-factor pluggable (SFP) module and related method are provided to perform additional packet processing in a communication network. The SFP module is generally configured to at least partially process data packets as they transit from a first networking equipment toward a second networking equipment in order to modify or otherwise update header information of the packets as a function of the content of their data payload. Modifying header information of data packets as they transit between interconnected networking equipments allows interconnected networking equipments to perform packet processing on the modified header information.

Small form-factor pluggable module

The disclosure relates to a tunable microring resonator, comprising a primary waveguide having first and second ends, a plurality of secondary waveguides each having a different length and each having first and second ends and a Micro-Electro-Mechanical System (MEMS) adjustable to optically couple at least a first end of the primary waveguide with a first respective end of a selected secondary waveguide thereby allowing light to circulate within the tunable microring resonator.

Tunable microring resonator

The teachings herein disclose a laser assembly () that implements a 'composite cavity' formed in part in a III/V die (), in part in a silicon die (), and in part in a glass member () having a waveguide () coupling the cavity portion in the III/V die with the cavity portion in the silicon die. This arrangement capitalizes on the lasing efficiency of the III/V die, which is used as the gain medium while advantageously using the glass member to extend the lasing cavity into the silicon die. Laser-scribing the cavity waveguide in place after mounting the III/V die, the silicon die or dies, and the glass member, greatly relaxes the mounting alignment precision needed for the constituent parts of the overall assembly. Moreover, in one or more embodiments, glass member includes one or more laser-scribed waveguides operative as optical interconnects going between two or more silicon dies.

Laser apparatus having a composite laser cavity

A silicon photonic device () comprising: a silicon core () having a core refractive index; and a structure formed in the silicon core, comprising: a first refractive index variation pattern () across the core in a first direction (x) and having a first modulation depth (H); and a second refractive index variation pattern () across the core in a second, orthogonal, direction (y) and having a second modulation depth (H), less than the first modulation depth. The first refractive index variation pattern overlays the second refractive index variation pattern, forming a three-dimensional structure. The first refractive index variation pattern only supports propagation of light having a TM mode between the first direction and a third direction (z) and the second refractive index variation pattern only supports propagation of light having a TE mode between the second direction and the third direction. An optical waveguide coupler is also disclosed. The optical waveguide coupler comprises a plurality of planar waveguides, each supporting propagation of one of a TE and a TM mode, and a plurality of silicon diffractive gratings each comprising a planar silicon core and a grating structure formed by a periodic refractive index variation extending across the core in a first direction and having a grating period and a modulation depth, these selected to cause the grating to support propagation of the light between the first direction and a third direction substantially orthogonal to the planar silicon core. Additionally the optical waveguide coupler comprises a plurality of tapered planar waveguides.

Silicon photonic device, optical polarisation beam coupler and optical waveguide coupler

Optical waveguide coupling ratios can be modified for a package by providing a substrate with a photonic circuit disposed on a first section of the substrate and a plurality of optical waveguides formed in glass disposed on a second section of the substrate, the waveguides being connected to the photonic circuit, adjacent ones of the waveguides having a fixed coupling ratio. A three-dimensional region of the glass abutting an end of one or more of the waveguides is lased to change a refractive index of the glass in each three-dimensional region, and thereby extend a length of each waveguide abutting one of the three-dimensional regions so that the coupling ratio between that waveguide and an adjacent waveguide is changed as a function of the extended length. The lasing is controlled based on feedback so that each coupling ratio changed by the lasing varies by less than a target amount.

Radiation scribed waveguide coupling for photonic circuits

A wavelength converter includes first silicon waveguides and second silicon waveguides intersecting the first silicon waveguides to form an arrayed waveguide. The arrayed waveguide receives optical data signals at the same wavelength at a first input and optical pump signals at different wavelengths at a second input. Microring resonators evanescently couple different ones of the first silicon waveguides to different ones of the second silicon waveguides. Each microring resonator is tuned to the wavelength of the optical data signals or one of the wavelengths of the optical pump signals, so that different combinations of the optical data signals and the optical pump signals are provided at an output of the arrayed waveguide. A non-linear optical media converts the wavelength of each combined optical signal at the output of the arrayed waveguide to yield wavelength converted signals each having a new dedicated wavelength.

Parallel and WDM silicon photonics integration in information and communications technology systems

An optical communications system includes a first plurality of optical components having optical ports, a second plurality of optical components having optical ports and an optical cross-connect. The optical cross-connect includes a block of a single continuous construction and material having a first side adjacent the first optical components and a second side adjacent the second optical components, and a plurality of non-intersecting, continuous waveguides formed within the block and extending from the first side of the block to the second side of the block. The refractive index of each waveguide is different than the surrounding material of the block, and each waveguide changes direction at least once within the block. The waveguides are optically aligned with the optical ports of the first optical components at the first side of the block and with the optical ports of the second optical components at the second side of the block.

High connectivity multiple dimension optical network in glass

A method of manufacturing an optical interconnect includes 3D printing a plurality of non-intersecting and spaced apart optical waveguides from a material that guides electromagnetic waves in the optical spectrum after being cross-linked or polymerized in a region activated by the 3D printing. At least some of the optical waveguides change direction at least once by about 90&#xb0;. The method further includes encasing at least each end of the optical waveguides with a material having a lower index of refraction than the material from which the optical waveguides are formed by 3D printing, to secure the optical waveguides. A corresponding 3D printing apparatus is also described.

Growing community of inventors

Mirabel, Canada

Stephane Lessard