International Business Machines Corporation

Stephane G Harel

Tymon Barwicz

Paul Francis Fortier

Roch Thivierge

Nicolas Boyer

Yurii A Vlasov

Isabel De Sousa

Guy Brouilette

Yvan Ferland

Simon LaFlamme

A picktip is provided and includes a picktip member configured to extend along a longitudinal axis defined in parallel with emissions from an ultraviolet (UV) light source. The picktip member partially includes UV transparent material through which the emissions are directed and has an end face from which the emissions are exited. The picktip member defines vacuum pathways terminating at the end face, and the end face has a non-planar topography.

Picktip having non-planar topography

A component assembly apparatus includes a first device supportive of a first component and a second device configured to bring a second component into contact with the first component. The second device is further configured to apply a first pressurizing force directed to force respective first surfaces of the first and second components together, and the first device is configured to convert a portion of the first pressurizing force into a second pressurizing force directed transversely with respect to the first pressurizing force to force respective second surfaces of the first and second components together.

Component assembly apparatus

A bondline control fixture and an active bondline control fixture are provided for affixing first and second components. The bondline control fixture includes a base fixable relative to a first component maneuvering device and comprising a first body defining an aperture and a first chamber and a second body disposable within the first chamber and defining a second chamber, a flexible membrane disposable to seal the second chamber, a mobile plate to which the second component is removably attachable, the mobile plate being disposable in contact with the flexible membrane and a pressure regulating system coupled to the second body and configured to regulate a pressure within the second chamber to deform the flexible membrane.

Bondline control fixture and method of affixing first and second components

A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.

Semiconductor photonic package

A vacuum controlled fixture is provided for positioning columns on sites of an electronic substrate. The fixture includes an internal chamber having spaced apart first and second surfaces extending beneath its principal face. A regular array of column receiving holes extends from the principal face through the first surface of the chamber, and a plurality of vacuum ducts extend from ports in the second surface of the chamber to a vacuum source to evacuate the internal chamber. The ports in the second face of the chamber are laterally offset from the receiving holes in the first face of the chamber to allow seating of the interior ends of the columns on coplanar portions of the rear surface. The ports are preferably centered, equidistant from the closest adjacent receiving holes, thereby providing centering of the columns by means of a vacuum driven air flow around the latter.

Growing community of inventors

Grandby, Canada

Stephane G Harel