Nordson Corporation

Stephane Etienne

Alec J Babiarz

Owen Yikon Sit

Per Orla-Jensen

Ronny Franken

Marc Knippenberg

Michel Van De Vijver

A system for applying a coating to a substrate. The system includes a coating station for applying a coating material to the substrate, where the coating station has a bottom portion, an oven for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion, and a first lift for transporting the substrate from the coating station to the oven. The system can also include an inspection station for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.

Systems for coating a substrate

Systems and methods for venting a solvent are disclosed. The system includes a chamber, such as an oven having an interior volume defining a heating zone, where the interior volume receives at least one substrate coated with a coating material comprising a solvent. The system further includes a vent coupled to the oven and defining a passage between the interior volume and the environment external to the oven. The system also includes a solvent sensor measuring an amount of evaporated solvent present in the interior volume, and a fan removing at least a portion of the solvent from the interior volume. The system may also include a coating assembly including an applicator and a flow meter, wherein the applicator applies a portion of the coating material to the substrate, and the flow meter determines the amount of coating material applied to the substrate.

Systems and methods for solvent extraction

Systems and methods for automated inspection of fillet formation along on or more peripheral edges (a) of a packaged microelectronic device () that is attached to a supporting substrate (), such system () including a feedback loop for controlling fillet formation. More specifically, the system () includes a dispensing system () configured for dispensing underfill material () onto the supporting substrate (). The system () further includes an automated optical inspection (AOI) system () configured for determining a value of a measurable attribute of the fillet (), such as whether the fillet () is properly dimensioned, i.e., sized and shaped. A feedback loop () is included between the dispensing system () and automated optical inspection system (). The feedback loop () is configured to communicate information from the AOI system () to the dispensing system () to permit adjustment of one or more operating parameters thereof, thereby maintaining proper dimensions of the fillet ().

Automated fillet inspection system with closed loop feedback and methods of use

Systems and methods for automated inspection of fillet formation along on or more peripheral edges () of a packaged microelectronic device () that is attached to a supporting substrate (), such system () including a feedback loop for controlling fillet formation. More specifically, the system () includes a dispensing system () configured for dispensing underfill material () onto the supporting substrate (). The system () further includes an automated optical inspection (AOI) system () configured for determining a value of a measurable attribute of the fillet (), such as whether the fillet () is properly dimensioned, i.e., sized and shaped. A feedback loop () is included between the dispensing system () and automated optical inspection system (). The feedback loop () is configured to communicate information from the AOI system () to the dispensing system () to permit adjustment of one or more operating parameters thereof, thereby maintaining proper dimensions of the fillet ().

Systems and methods for automated inspection of fillet formation along on or more peripheral edges () of a packaged microelectronic device () that is attached to a supporting substrate (), such system () including a feedback loop for controlling fillet formation More specifically, the system () includes a dispensing system () configured for dispensing underfill material () onto the supporting substrate () The system () further includes an automated optical inspection (AOI) system () configured for determining a value of a measurable attribute of the fillet (), such as whether the fillet () is properly dimensioned, i e, sized and shaped A feedback loop () is included between the dispensing system () and automated optical inspection system ().

Growing community of inventors

Bouaye, France

Stephane Etienne