Osram Opto Semiconductors Gmbh

Stephan Preuss

Michael Zitzlsperger

Markus Pindl

Thomas Bemmerl

Martin Brandl

Harald Jäger

Markus Boss

Kirstin Petersen

Harald Jaeger

A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.

Leadframe assembly, housing assembly, module assembly and method of determining at least one value of a measurement variable of an electronic module

An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method.

Optical element, optoelectronic component and method for the production thereof

A radiation-emitting component including a semiconductor chip having a semiconductor body with an active region that generates a primary radiation, and including a conversion element that at least partly converts the primary radiation, wherein the conversion element is fixed to the semiconductor chip with a connecting layer and a radiation conversion substance is formed in the connecting layer.

Radiation-emitting component and method for producing a radiation-emitting component

A method for producing a plurality of radiation-emitting components includes A) providing a carrier layer having a plurality of mounting regions separated from one another by separating regions; B) applying an interlayer to the separating regions; C) applying a respective radiation-emitting device to each of the plurality of mounting regions; D) applying a continuous potting layer to the radiation-emitting device and the separating regions; E) severing the potting layer and partially severing the interlayer in the separating regions of the carrier layer in a first separating step; and F) partially severing the interlayer and severing the carrier layer in a second separating step, wherein the interlayer is completely severed by the first and the second separating step.

Method for producing a plurality of radiation-emitting components and radiation-emitting component

A process of producing a layer composite includes a luminescence conversion layer and a scattering layer, wherein a press having a first pressing tool with a cavity and a second pressing tool is used including introducing a first polymer including a luminescence conversion substance into the cavity, inserting a film between the first and second tools, closing the press and carrying out a first pressing, hardening the first polymer to form a luminescence conversion layer in the press, opening the press, wherein the luminescence conversion layer adhering to the film remains in the press, introducing a second polymer including scattering particles into the cavity, closing the press and carrying out a second pressing, hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer, opening the press, and removing the support film with the layer composite including the luminescence conversion layer and the scattering layer.

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Bad Abbach, Germany

Stephan Preuss