International Business Machines Corporation

Egypt Nanotechnology Center

Globalfoundries Inc.

Stephan Paredes

Bruno Michel

Thomas J Brunschwiler

Harry S Barowski

Andreas Huber

Hubert Harrer

Tim Niggemeier

Jochen Supper

Gerd Schlottig

Werner Escher

Patrick Ruch

Ingmar G Meijer

Jonas R Weiss

Roger F Dangel

Norbert M Meier

Emanuel Loertscher

Chin Lee Ong

Stefano Sergio Oggioni

Rami Ghannam

Javier V Goicochea

Mauro Spreafico

Andreas Fuhrer Janett

Giorgio Viero

Matthias Mergenthaler

Brian Burg

Ahmed S G Khalil

Michael J Ellsworth, Jr

Evan G Colgan

Jeffrey Allen Zitz

Peter Mueller

Andreas Christian Doering

Heiko Wolf

Ronald Peter Luijten

Stefan Filipp

Thilo Hermann Curt Stoeferle

Martin Witzig

Matteo Cossale

A method of modifying a resonant frequency of a quantum device includes generating an ion beam having a beam energy and exposing a surface of the quantum device to the ion beam for an exposure time. The ion beam is incident onto the quantum device at an oblique angle that is less than 90 degrees as measured from the surface of the quantum device. The quantum device includes a Josephson junction, the ion beam exposing the quantum device proximate to the Josephson junction to modify a property of the Josephson junction, the property being associated with the resonant frequency of the quantum device.

Ion milling for frequency tuning of superconducting qubits

A device package includes a chip carrier having a cavity and one or more microwave waveguides configured to route signals. There is a chip including one or more pads and located within the cavity of the chip carrier. Each pad is aligned with a corresponding connector pad of a microwave waveguide of the one or more microwave waveguides of the chip carrier. At least one of the one or more pads is coupled to the connector pad of the corresponding microwave waveguide by way of an overlap capacitive coupling between the at least one pad and the aligned corresponding connector pad of the microwave waveguide.

Fast radio frequency package

One or more embodiments of the present invention are directed to a photovoltaic system. The system comprises photovoltaic cells, arranged side-by-side to form an array of photovoltaic cells. It further involves a cooling device, which comprises one or more layers, wherein the layers extend opposite to the array of photovoltaic cells and in thermal communication therewith, for cooling the cells, in operation. The one or more layers are structured such that a thermal resistance of the photovoltaic system varies across the array of photovoltaic cells, so as to remove heat from photovoltaic cells of the array with different heat removal rates, in operation. One or more embodiments of the present invention are further directed to related systems and methods for cooling such photovoltaic systems.

Photovoltaic system with non-uniformly cooled photovoltaic cells

The present invention is notably directed to a photovoltaic module, or PV module, comprising an array of photovoltaic cells, or PV cells, and electrical interconnects. The array of PV cells comprises N portions, N&#x2265;2, where the portions comprise, each, disjoint sets of PV cells of the array. The electrical interconnects connect the PV cells and the N portions of the array so as for PV cells within each of said portions to be electrically connected in parallel and the N portions to be connected in series. The PV cells and the portions are connected, via said interconnects, so to output an electrical current, in operation. The electrical interconnects are otherwise configured to provide electrical signals from each of the N portions. The invention is further directed to related systems and methods of fabrication and operation.

Photovoltaic module

A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-&#xe0;-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

Disconnect assembly for active cooling of packaged electronics

An embodiment of the invention may include a sealing apparatus. The sealing apparatus may include a first component having a body, where the body has an outer surface and a first arm protruding from the outer surface. The first arm includes an inner surface facing the outer surface of the body. The sealing apparatus may include a second component engaged by the first arm of the first component. The second component may have a first portion arranged inside a space between the inner surface of the first arm and the outer surface of the body and a second portion arranged outside of the space and adjacent to an outer surface of the first arm.

Sealing arrangement

A device for converting heat into mechanical energy is disclosed. The device includes a channel flow boiler having at least one channel adapted to heat a working fluid for generating a liquid-gas mixture; an expansion device adapted to expand the liquid-gas mixture; and a movable element arranged such that the expanding liquid-gas mixture at least partially converts an internal and/or kinetic energy of the liquid-gas mixture into mechanical energy associated with the movable element; wherein the channel flow boiler and/or the expansion device is adapted to supply heat to the liquid-gas mixture.

Device and method for converting heat into mechanical energy

This invention relates to cooling devices for multi-chip semiconductor devices, system-on-a-package devices, and other packaged devices. Because of the non-uniform height across the surface in such large-chip and multi-chip assemblies, providing heat exchange can be troublesome. Many air cooled heat sinks are too stiff to adapt to such non-uniform or warped shapes of chips or to shape-changing chip surfaces during operation. In the present disclosure, application of a mechanical load perpendicular to the chip plane causes certain features to flex and adapt to the non-uniform height of the chip plane, providing improved heat exchange.

High-performance compliant heat-exchanger comprising vapor chamber

A method is disclosed for operating a photovoltaic thermal hybrid system having a hybrid solar receiver with a photovoltaic module, operatively coupled to the system to deliver an electrical output power for a power user, a thermal collector distinct from the photovoltaic module, wherein the photovoltaic module and/or the thermal collector are movably mounted in the system, a collector thermal storage thermally connected to the thermal collector to store heat collected at the thermal collector, and a positioning mechanism adapted to move the photovoltaic module and/or the thermal collector. The method includes instructing the positioning mechanism to move the photovoltaic module and/or the thermal collector to change a ratio of an intensity of radiation received at the photovoltaic module to an intensity of radiation received at the thermal collector.

Photovoltaic thermal hybrid systems and method of operation thereof

A mechanism is provided for cooling electronic components of a printed circuit board module and for supplying power to the electronic components of the printed circuit board module. The computer module comprises a printed circuit board module, wherein the electronic components are attached to a first side of the printed circuit board module, and a cooling module being attached to a second side of the printed circuit board, being arranged in parallel to the printed circuit board and having a first layer being thermally and electrically conductive. The first layer is arranged such that heat is dissipated from the printed circuit board module and that power from a power source is supplied to the electronic components of the printed circuit board module.

Cooling electronic components and supplying power to the electronic components

An apparatus and corresponding method for heat exchange. The heat exchange apparatus may include an adsorber device. The adsorber device is configured to draw heat from a first heat reservoir and transfer heat to a first heat sink. The heat exchange apparatus may include a heat exchanger fluidly connected to the adsorber device by the working fluid. The heat exchanger transfers heat to a second heat sink. The heat exchange apparatus may include an expansion device fluidly connected to the heat exchanger by the working fluid. The expansion device expands the working fluid, and exchanges heat with a second heat reservoir. The expansion device includes a turbine device for converting at least a part of an exergy of the working fluid during expansion into mechanical work. The heat exchange apparatus may include the adsorber device being fluidly connected to the expansion device by the working fluid.

Adsorbing heat exchanger

The present invention is notably directed to a cooling device, e.g., for computer hardware. The device comprises a deformable, outer chamber, having at least one thermally conducting section, the latter suited for thermally contacting a heat source of a computer hardware. The outer chamber is deformable upon a pressure increase therein. The cooling device further comprises at least one inner chamber nested in the outer chamber, the inner chamber expandable in volume upon a pressure increase therein. The invention is further directed to a computer hardware apparatus comprising such a cooling device, or stacks of such cooling devices paired with respective set of electronic components.

Cooling device with nested chambers for computer hardware

Growing community of inventors

Zurich, Switzerland

Stephan Paredes