Stmicroelectronics (rousset) Sas

Stmicroelectronics (crolles 2) Sas

Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Stmicroelectronics (grenoble 2) Sas

Stephan Niel

Arnaud Regnier

Francesco La Rosa

Abderrezak Marzaki

Julien Delalleau

Marc Mantelli

Jean-Michel Mirabel

Franck Julien

Quentin Hubert

Thomas Cabout

Yoann Goasduff

Leo Gave

Pascal Fornara

Philippe Boivin

Olivier Weber

Benoit Froment

Benoît Froment

Laurent Lopez

Emmanuel Richard

Olivier Pizzuto

Hélène Dalle-Houilliez

First and second wells are formed in a semiconductor substrate. First and second trenches in the first second wells, respectively, each extend vertically and include a central conductor insulated by a first insulating layer. A second insulating layer is formed on a top surface of the semiconductor substrate. The second insulating layer is selectively thinned over the second trench. A polysilicon layer is deposited on the second insulating layer and then lithographically patterned to form: a first polysilicon portion over the first well that is electrically connected to the central conductor of the first trench to form a first capacitor plate, a second capacitor plate formed by the first well; and a second polysilicon portion over the second well forming a floating gate electrode of a floating gate transistor of a memory cell having an access transistor whose control gate is formed by the central conductor of the second trench.

Co-integrated vertically structured capacitive element and fabrication process

A method for manufacturing an electronic device includes locally implanting ionic species into a first region of a silicon nitride layer and into a first region of an electrically insulating layer located under the first region of the silicon nitride layer. A second region of the silicon nitride layer and a region of the electrically insulating layer located under the second region of the silicon nitride layer are protected from the implantation. The electrically insulating layer is disposed between a semi-conducting substrate and the silicon nitride layer. At least one trench is formed extending into the semi-conducting substrate through the silicon nitride layer and the electrically insulating layer. The trench separates the first region from the second region of the electrically insulating layer. The electrically insulating layer is selectively etched, and the etch rate of the electrically insulating layer in the first region is greater than the etch rate in the second region.

Method for manufacturing an electronic device

In accordance with an embodiment, a physically unclonable function device includes a set of transistor pairs, transistors of the set of transistor pairs having a randomly distributed effective threshold voltage belonging to a common random distribution; a differential read circuit configured to measure a threshold difference between the effective threshold voltages of transistors of transistor pairs of the set of transistor pairs, and to identify a transistor pair in which the measured threshold difference is smaller than a margin value as being an unreliable transistor pair; and a write circuit configured to shift the effective threshold voltage of a transistor of the unreliable transistor pair to be inside the common random distribution.

Device of physically unclonable function with transistors, and manufacturing method

A capacitive element includes a trench extending vertically into a well from a first side. The trench is filled with a conductive central section clad with an insulating cladding. The capacitive element further includes a first conductive layer covering a first insulating layer that is located on the first side and a second conductive layer covering a second insulating layer that is located on the first conductive layer. The conductive central section and the first conductive layer are electrically connected to form a first electrode of the capacitive element. The second conductive layer and the well are electrically connected to form a second electrode of the capacitive element. The insulating cladding, the first insulating layer and the second insulating layer form a dielectric region of the capacitive element.

Integrated circuit with vertically structured capacitive element, and its fabricating process

In accordance with an embodiment of the present invention, a method of making a semiconductor device includes simultaneously etching a semiconductor layer and a conductive layer to form a self-aligned diode region disposed on an insulating layer, where the semiconductor layer has a first conductivity type. The method further includes etching through first openings of a mask layer to form first implantation surfaces on the semiconductor layer and to form a plurality of projecting regions including conductive material of the conductive layer over the semiconductor layer. The method further includes using the plurality of projecting regions as a part of a first implantation mask, performing a first implantation of dopants having a second conductivity type into the semiconductor layer, to form a sequence of PN junctions forming diodes in the semiconductor layer. The diodes vertically extend from an upper surface of the semiconductor layer to the insulating layer.

Structure and method of forming a semiconductor device

A semiconductor region includes an isolating region which delimits a working area of the semiconductor region. A trench is located in the working area and further extends into the isolating region. The trench is filled by an electrically conductive central portion that is insulated from the working area by an isolating enclosure. A cover region is positioned to cover at least a first part of the filled trench, wherein the first part is located in the working area. A dielectric layer is in contact with the filled trench. A metal silicide layer is located at least on the electrically conductive central portion of a second part of the filled trench, wherein the second part is not covered by the cover region.

Integrated filler capacitor cell device and corresponding manufacturing method

A split-gate memory cell includes a state transistor possessing a control gate and a floating gate and a selection transistor possessing a selection gate. The split-gate memory cell is programmed by applying, during a programming duration, a first voltage to the control gate, a second voltage to a drain of the state transistor and a third voltage to the selection gate of the selection transistor. The third voltage is transitioned during the programming duration between a first value and a second value greater than the first value.

Method for programming a split-gate memory cell and corresponding memory device

A memory device includes a first state transistor and a second state transistor having a common control gate. A first selection transistor is buried in the semiconductor body and coupled to the first state transistor so that current paths of the first selection transistor and first state transistor are coupled in series. A second selection transistor is buried in the semiconductor body and coupled to the second state transistor so that current paths of the second selection transistor and second state transistor are coupled in series. The first and second selection transistors have a common buried selection gate. A dielectric region is located between the common control gate and the semiconductor body. A first bit line is coupled to the first state transistor and a second bit line is coupled to the second state transistor.

Compact non-volatile memory device of the type with charge trapping in a dielectric interface

An integrated circuit includes a semiconductor substrate with an electrically isolated semiconductor well. An upper trench isolation extends from a front face of the semiconductor well to a depth located a distance from the bottom of the well. Two additional isolating zones are electrically insulated from the semiconductor well and extending inside the semiconductor well in a first direction and vertically from the front face to the bottom of the semiconductor well. At least one hemmed resistive region is bounded by the two additional isolating zones, the upper trench isolation and the bottom of the semiconductor well. Electrical contacts are electrically coupled to the hemmed resistive region.

Integrated circuit with improved resistive region

The present disclosure relates to a memory cell comprising a vertical selection gate extending in a trench made in a substrate, a floating gate extending above the substrate, and a horizontal control gate extending above the floating gate, wherein the floating gate also extends above a portion of the vertical selection gate over a non-zero overlap distance. Application mainly to the production of a split gate memory cell programmable by hot-electron injection.

Growing community of inventors

Meylan, France

Stephan Niel