Keyssa Systems, Inc.

Stephan Lang

Eric Sweetman

Alan Besel

Giriraj Mantrawadi

Dennis F Rosenauer

Ian A Kyles

Roger Dwain Isaac

Srikanth Gondi

James Gill Shook

Bojana Zivanovic

Embodiments discussed herein refer to connectors that enable two structures or devices to be coupled together in a manner that enables consistent and reliable operation of contactless communications and power transfer. The connector integrates power and alignment such that when two connectors are coupled together the power connections are also responsible for connector alignment. The connector alignment ensures that contactless communication channels, spanning between the connectors, are aligned to enable consistent and reliable operation of contactless communications.

Mechanical connectors for contactless communication units

Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. Launch structures that interface with waveguides are also disclosed herein. Launch structures can control the EHF interface impedance between a contactless communication unit and the waveguide. Waveguide structures discussed herein are designed to provide maximum bandwidth with minimal jitter over a desired distance.

Launch assembly for coupling EM signals between a CCU and a waveguide, where the CCU is enclosed by a cover region including transition and waveguide interface regions therein for coupling to the waveguide

Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.

Cross-talk blocking structures for EM communication

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San Jose, CA, United States of America

Stephan Lang