Harman Becker Automotive Systems Gmbh

Wmf Gmbh

Wmf Group Gmbh

Stephan Joos

Guenther Kraft

Bernhard Weigl

Krunoslav Orcic

Günther Kraft

Walter Knappich

Didier Berthomier

Andreas Schiffmann

Kronoslav Orcic

Johannes Striggow

Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Method for producing a circuit board system

Growing community of inventors

Karlsbad, Germany

Stephan Joos