Macdermid Enthone Gmbh

Stephan I Braye

Kyle M Whitten

Elie H Najjar

Thomas B Richardson

Shaopeng Sun

Jianwen Han

Pingping Ye

A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.

Compositions and methods for the electrodeposition of nanotwinned copper

An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.

Cobalt chemistry for smooth topology

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West Haven, CT, United States of America

Stephan I Braye